@inproceedings{55f23f68bac247638ac36297f2a6e9d8,
title = "Effect of electromigration of Sn-xAg-Cu solder joints on its microstructure and mechanical properties",
abstract = "In this study, effect of electromigration of Sn-0.7Cu, Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder joints on the microstructure and mechanical properties were investigated. Within a certain range, addition of Ag enhanced the electromigration stressing resistance and the joint strength. Electromigration changed the distribution and morphology of the IMC. In cathode side, the Cu6Sn5 layer reduces with the increasing time, while in anode side, the Cu6Sn5 layer would increased with the increasing time. Electromigration reduced the mechanical properties of linear joints. The drop rate of ultimate tensile strength has a linear relationship with the stressing time. According to the fracture morphology, the fracture mechanism changed from ductile to cleavage fracture.",
keywords = "Ag content, electromigration, joint strength, microstructure",
author = "Shuang Tian and Fengjiang Wang and Dongyang Li and Peng He",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 16th International Conference on Electronic Packaging Technology, ICEPT 2015 ; Conference date: 11-08-2015 Through 14-08-2015",
year = "2015",
month = sep,
day = "1",
doi = "10.1109/ICEPT.2015.7236588",
language = "英语",
series = "16th International Conference on Electronic Packaging Technology, ICEPT 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "256--259",
editor = "Hu He and Keyun Bi and Wenhui Zhu",
booktitle = "16th International Conference on Electronic Packaging Technology, ICEPT 2015",
address = "美国",
}