Skip to main navigation Skip to search Skip to main content

Effect of Drift Length on Shifts in 400-V SOI LDMOS Breakdown Voltage Due to TID

  • Lei Shu
  • , Yuan Fu Zhao*
  • , Kenneth F. Galloway*
  • , Liang Wang
  • , Xin Sheng Wang
  • , Zhang Yi An Yuan
  • , Xin Zhou
  • , Wei Ping Chen
  • , Ming Qiao*
  • , Tian Qi Wang*
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • Vanderbilt University
  • Beijing Microelectronics Technology Institute
  • Harbin Institute of Technology Weihai
  • University of Electronic Science and Technology of China

Research output: Contribution to journalArticlepeer-review

Abstract

Recently, Shu et al. published 'Numerical and Experimental Investigation of TID Radiation Effect on the Breakdown Voltage of 400 V SOI NLDMOS.' This short article is an extension of that earlier article. The breakdown voltage of 400-V silicon-on-insulator n-channel laterally diffused metal-oxide semiconductor field-effect transistors with different drift region lengths are examined after exposure to total ionizing dose. The variation observed is analyzed using technology computer-aided design simulation.

Original languageEnglish
Article number8977477
Pages (from-to)2392-2395
Number of pages4
JournalIEEE Transactions on Nuclear Science
Volume67
Issue number11
DOIs
StatePublished - Nov 2020

Keywords

  • Breakdown voltage
  • drift region length
  • silicon-on-insulator (SOI) laterally diffused metal oxide semiconductor field-effect transistors (LDMOSFETs)
  • technology computer-aided design (TCAD) simulation
  • total dose

Fingerprint

Dive into the research topics of 'Effect of Drift Length on Shifts in 400-V SOI LDMOS Breakdown Voltage Due to TID'. Together they form a unique fingerprint.

Cite this