Abstract
Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder powders, mixing with flux and reflowing at 260 °C for 60 s. The spreading areas of composite solder were calculated and the distributions of copper-coated diamonds were characterized. When diamond additions were below 3 wt%, the spreading area decreased with diamond additions, and the diamonds distributed mainly at the interface between solder and Cu pad; however, when additions were beyond 4 wt%, the discharge of diamond particle occurred, and the spreading area increased due to the reduction of surface energy.
| Original language | English |
|---|---|
| Pages (from-to) | 661-665 |
| Number of pages | 5 |
| Journal | Journal of Materials Science and Technology |
| Volume | 28 |
| Issue number | 7 |
| DOIs | |
| State | Published - Jul 2012 |
Keywords
- Chemical plating
- Composite solder
- Diamond
- Sn3.0Ag0.5Cu
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