@inproceedings{9b391d088d8e4b59a2fce9aa94d2502e,
title = "Effect of defected behavior on interfacial heat transferring performance for HP-LED packaging based on entropy generation analysis",
abstract = "Entropy generation is a kind of available energy loss. It is an important topic in the field of heat conduction and energy design. There are many interfaces inside the chip of high power LED (HP-LED), and these interfaces are easily affected by wet-heat stress and cause interface defects, such as interface cracking. The effect of defected behavior on interfacial heat transferring performance for HP-LED packaging based on entropy generation theory is proposed. First, the influence of different cracks length on the entropy generation at the topinterface is studied. Second, the temperature distribution of DA with different cracking lengths is showed. Finally, the delamination on top and bottom-interface are compared. The results show that, under the same situations, the entropy generation value of bottom-interface is larger than that of the top-interface, which implies that the influence of the heat transfer ability in bottom-interface of the DA layer is more serious.",
keywords = "DA layer, Thermal effect, cracking, entropy generation",
author = "Peng Cui and Miao Cai and Daoguo Yang",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 19th International Conference on Electronic Packaging Technology, ICEPT 2018 ; Conference date: 08-08-2018 Through 11-08-2018",
year = "2018",
month = oct,
day = "2",
doi = "10.1109/ICEPT.2018.8480565",
language = "英语",
series = "Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "423--427",
editor = "Fei Xiao and Jun Wang and Lin Chen and Tianchun Ye",
booktitle = "Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018",
address = "美国",
}