Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints

Mingyue Xiong; Liang Zhang; Lei Sun; Peng He; Weimin Long

doi:10.1016/j.vacuum.2019.06.024

Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints

Mingyue Xiong
, Liang Zhang^*
, Lei Sun
, Peng He
, Weimin Long

^*Corresponding author for this work

School of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

74 Scopus citations

Abstract

In order to reduce the formation of voids in the Cu/Sn58Bi/Cu solder joints during transient liquid phase (TLP) bonding, the effect of CuZnAl particles on microstructure of Cu/SnBi/Cu TLP bonding solder joints was investigated. After bonding, the prism-type Cu₆Sn₅ intermetallic compounds (IMCs) were formed at the interface. The growth of Cu₆Sn₅ IMC grains was controlled by the interface reaction flux J₂. The prism-type Cu₃Sn IMCs grew at the expense of Cu₆Sn₅ IMCs. With the increase of bonding time, the solder joints were converted into all IMCs, indicating that SnBi solder and SnBi-0.5 CuZnAl solder are suitable for low-temperature bonding and high-temperature applications. When the CuZnAl particles were added, the growth of the interfacial IMCs was inhibited, and the formation of voids was significantly reduced.

Original language	English
Pages (from-to)	301-306
Number of pages	6
Journal	Vacuum
Volume	167
DOIs	https://doi.org/10.1016/j.vacuum.2019.06.024
State	Published - Sep 2019

Keywords

Interfacial reaction
SnBi solder
TLP bonding
Void formation

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10.1016/j.vacuum.2019.06.024

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@article{e8235e8d95bd4d71bcb37c7b896403e0,

title = "Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints",

abstract = "In order to reduce the formation of voids in the Cu/Sn58Bi/Cu solder joints during transient liquid phase (TLP) bonding, the effect of CuZnAl particles on microstructure of Cu/SnBi/Cu TLP bonding solder joints was investigated. After bonding, the prism-type Cu6Sn5 intermetallic compounds (IMCs) were formed at the interface. The growth of Cu6Sn5 IMC grains was controlled by the interface reaction flux J2. The prism-type Cu3Sn IMCs grew at the expense of Cu6Sn5 IMCs. With the increase of bonding time, the solder joints were converted into all IMCs, indicating that SnBi solder and SnBi-0.5 CuZnAl solder are suitable for low-temperature bonding and high-temperature applications. When the CuZnAl particles were added, the growth of the interfacial IMCs was inhibited, and the formation of voids was significantly reduced.",

keywords = "Interfacial reaction, SnBi solder, TLP bonding, Void formation",

author = "Mingyue Xiong and Liang Zhang and Lei Sun and Peng He and Weimin Long",

note = "Publisher Copyright: {\textcopyright} 2019 Elsevier Ltd",

year = "2019",

month = sep,

doi = "10.1016/j.vacuum.2019.06.024",

language = "英语",

volume = "167",

pages = "301--306",

journal = "Vacuum",

issn = "0042-207X",

publisher = "Elsevier Ltd",

}

TY - JOUR

T1 - Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints

AU - Xiong, Mingyue

AU - Zhang, Liang

AU - Sun, Lei

AU - He, Peng

AU - Long, Weimin

PY - 2019/9

Y1 - 2019/9

N2 - In order to reduce the formation of voids in the Cu/Sn58Bi/Cu solder joints during transient liquid phase (TLP) bonding, the effect of CuZnAl particles on microstructure of Cu/SnBi/Cu TLP bonding solder joints was investigated. After bonding, the prism-type Cu6Sn5 intermetallic compounds (IMCs) were formed at the interface. The growth of Cu6Sn5 IMC grains was controlled by the interface reaction flux J2. The prism-type Cu3Sn IMCs grew at the expense of Cu6Sn5 IMCs. With the increase of bonding time, the solder joints were converted into all IMCs, indicating that SnBi solder and SnBi-0.5 CuZnAl solder are suitable for low-temperature bonding and high-temperature applications. When the CuZnAl particles were added, the growth of the interfacial IMCs was inhibited, and the formation of voids was significantly reduced.

AB - In order to reduce the formation of voids in the Cu/Sn58Bi/Cu solder joints during transient liquid phase (TLP) bonding, the effect of CuZnAl particles on microstructure of Cu/SnBi/Cu TLP bonding solder joints was investigated. After bonding, the prism-type Cu6Sn5 intermetallic compounds (IMCs) were formed at the interface. The growth of Cu6Sn5 IMC grains was controlled by the interface reaction flux J2. The prism-type Cu3Sn IMCs grew at the expense of Cu6Sn5 IMCs. With the increase of bonding time, the solder joints were converted into all IMCs, indicating that SnBi solder and SnBi-0.5 CuZnAl solder are suitable for low-temperature bonding and high-temperature applications. When the CuZnAl particles were added, the growth of the interfacial IMCs was inhibited, and the formation of voids was significantly reduced.

KW - Interfacial reaction

KW - SnBi solder

KW - TLP bonding

KW - Void formation

UR - https://www.scopus.com/pages/publications/85067690134

U2 - 10.1016/j.vacuum.2019.06.024

DO - 10.1016/j.vacuum.2019.06.024

M3 - 文章

AN - SCOPUS:85067690134

SN - 0042-207X

VL - 167

SP - 301

EP - 306

JO - Vacuum

JF - Vacuum

ER -

Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints

Abstract

Keywords

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