Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution

H. Xu; C. Liu; V. V. Silberschmidt; Z. Chen; J. Wei; M. Sivakumar

doi:10.1016/j.microrel.2010.03.016

Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution

H. Xu^*
, C. Liu
, V. V. Silberschmidt
, Z. Chen
, J. Wei
, M. Sivakumar

^*Corresponding author for this work

Loughborough University
Nanyang Technological University
Agency for Science, Technology and Research, Singapore
ASM Technology Singapore Pte. Ltd.

Research output: Contribution to journal › Article › peer-review

30 Scopus citations

Abstract

The effect of bonding duration and substrate temperature on the nano-scale interfacial structure for bonding strength were investigated using high resolution transmission electron microscopy. It shows that intermetallic compound crystallization correlates with bonding duration, as a longer duration is applied, alumina fragmentation becomes pervasive, resulting in continuous alloy interfaces and robust bonds. In addition, a substrate temperature (i.e. 175 °C) promotes the fracture of alumina, and simultaneously contributes to the interfacial temperature, accelerating interdiffusion and facilitating the formation of intermetallic compounds, therefore increasing bonding strength. The compound formed during bonding is CuAl₂, regardless of the bonding parameters applied.

Original language	English
Pages (from-to)	113-118
Number of pages	6
Journal	Microelectronics Reliability
Volume	51
Issue number	1
DOIs	https://doi.org/10.1016/j.microrel.2010.03.016
State	Published - Jan 2011
Externally published	Yes

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title = "Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution",

abstract = "The effect of bonding duration and substrate temperature on the nano-scale interfacial structure for bonding strength were investigated using high resolution transmission electron microscopy. It shows that intermetallic compound crystallization correlates with bonding duration, as a longer duration is applied, alumina fragmentation becomes pervasive, resulting in continuous alloy interfaces and robust bonds. In addition, a substrate temperature (i.e. 175 °C) promotes the fracture of alumina, and simultaneously contributes to the interfacial temperature, accelerating interdiffusion and facilitating the formation of intermetallic compounds, therefore increasing bonding strength. The compound formed during bonding is CuAl2, regardless of the bonding parameters applied.",

author = "H. Xu and C. Liu and Silberschmidt, \{V. V.\} and Z. Chen and J. Wei and M. Sivakumar",

year = "2011",

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doi = "10.1016/j.microrel.2010.03.016",

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T1 - Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads

T2 - A TEM study of interfacial evolution

AU - Xu, H.

AU - Liu, C.

AU - Silberschmidt, V. V.

AU - Chen, Z.

AU - Wei, J.

AU - Sivakumar, M.

PY - 2011/1

Y1 - 2011/1

N2 - The effect of bonding duration and substrate temperature on the nano-scale interfacial structure for bonding strength were investigated using high resolution transmission electron microscopy. It shows that intermetallic compound crystallization correlates with bonding duration, as a longer duration is applied, alumina fragmentation becomes pervasive, resulting in continuous alloy interfaces and robust bonds. In addition, a substrate temperature (i.e. 175 °C) promotes the fracture of alumina, and simultaneously contributes to the interfacial temperature, accelerating interdiffusion and facilitating the formation of intermetallic compounds, therefore increasing bonding strength. The compound formed during bonding is CuAl2, regardless of the bonding parameters applied.

AB - The effect of bonding duration and substrate temperature on the nano-scale interfacial structure for bonding strength were investigated using high resolution transmission electron microscopy. It shows that intermetallic compound crystallization correlates with bonding duration, as a longer duration is applied, alumina fragmentation becomes pervasive, resulting in continuous alloy interfaces and robust bonds. In addition, a substrate temperature (i.e. 175 °C) promotes the fracture of alumina, and simultaneously contributes to the interfacial temperature, accelerating interdiffusion and facilitating the formation of intermetallic compounds, therefore increasing bonding strength. The compound formed during bonding is CuAl2, regardless of the bonding parameters applied.

UR - https://www.scopus.com/pages/publications/78651437984

U2 - 10.1016/j.microrel.2010.03.016

DO - 10.1016/j.microrel.2010.03.016

M3 - 文章

AN - SCOPUS:78651437984

SN - 0026-2714

VL - 51

SP - 113

EP - 118

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 1

ER -

Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution

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