Abstract
The Sn, Ni, P were added into AgCuZnSn brazing alloy. And the effects of Sn, Ni and P on the microstructure and property of AgCuZn cadmium-free brazing alloy system were investigated. The results showed that the wettability of the brazing alloy was improved with the addition of Sn. The addition of P could decrease the interfacial tension between liquid brazing alloy and specimen, and the wettability and fluidity were also improved. The microstructure of AgCuZn brazing alloy was consisted of Cu-rich phase, CuZn intermetallic compound, Cu5.6Sn intermetallic compound, Cu40.5Sn11 intermetallic compound and Ag-rich phase. Dendrite that formed in the alloy microstructure make brazing alloy friable after the addition of Sn. The black Ni3P compound was generated when Ni was added, and make microstructure homogeneous. The gray Cu3P compound was generated when P was added.
| Original language | English |
|---|---|
| Pages (from-to) | 65-68 |
| Number of pages | 4 |
| Journal | Hanjie Xuebao/Transactions of the China Welding Institution |
| Volume | 29 |
| Issue number | 3 |
| State | Published - Mar 2008 |
Keywords
- Brazing alloy
- Microstructure
- Wettability
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