Effect of AG nanopowders on microstructure, hardness and elastic modulus of SN-BI solders

X. C. Lü; P. He; F. Pan; B. Du; F. J. Lu; Y. Y. Qian

Effect of AG nanopowders on microstructure, hardness and elastic modulus of SN-BI solders

X. C. Lü
, P. He^*
, F. Pan
, B. Du
, F. J. Lu
, Y. Y. Qian

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology
Harbin Welding Institute

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

This paper presents the microstructure, hardness and elastic modulus of Sn58Bi, Sn57Bi1Ag and Ag nanopowders reinforced Sn58Bi composite solders. Microstructural observations reveal that the Ag nanopowders reinforced Sn58Bi composite solders have smaller grains of Ag3Sn and a more uniform Ag3Sn distribution in comparison with those of Sn57Bi1Ag solder. Nanoindentation test results show that the addition of Ag nanopowders has greatly enhanced the mechanical properties of Sn58Bi solder, i.e., it exhibits 13-30% increase in hardness and 10-22% increase in modulus of the composite solder. Besides, hardness and elastic modulus of solder are dependent on the size, distribution and the quantity of the second-phase.

Original language	English
Pages (from-to)	63-68
Number of pages	6
Journal	Engineering Review
Volume	34
Issue number	2
State	Published - Jun 2014

Cite this

@article{098b59970a4c4427ac220b9f0d9eec64,

title = "Effect of AG nanopowders on microstructure, hardness and elastic modulus of SN-BI solders",

abstract = "This paper presents the microstructure, hardness and elastic modulus of Sn58Bi, Sn57Bi1Ag and Ag nanopowders reinforced Sn58Bi composite solders. Microstructural observations reveal that the Ag nanopowders reinforced Sn58Bi composite solders have smaller grains of Ag3Sn and a more uniform Ag3Sn distribution in comparison with those of Sn57Bi1Ag solder. Nanoindentation test results show that the addition of Ag nanopowders has greatly enhanced the mechanical properties of Sn58Bi solder, i.e., it exhibits 13-30\% increase in hardness and 10-22\% increase in modulus of the composite solder. Besides, hardness and elastic modulus of solder are dependent on the size, distribution and the quantity of the second-phase.",

author = "L{\"u}, \{X. C.\} and P. He and F. Pan and B. Du and Lu, \{F. J.\} and Qian, \{Y. Y.\}",

year = "2014",

month = jun,

language = "英语",

volume = "34",

pages = "63--68",

journal = "Engineering Review",

issn = "1330-9587",

publisher = "University of Rijeka",

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}

TY - JOUR

T1 - Effect of AG nanopowders on microstructure, hardness and elastic modulus of SN-BI solders

AU - Lü, X. C.

AU - He, P.

AU - Pan, F.

AU - Du, B.

AU - Lu, F. J.

AU - Qian, Y. Y.

PY - 2014/6

Y1 - 2014/6

N2 - This paper presents the microstructure, hardness and elastic modulus of Sn58Bi, Sn57Bi1Ag and Ag nanopowders reinforced Sn58Bi composite solders. Microstructural observations reveal that the Ag nanopowders reinforced Sn58Bi composite solders have smaller grains of Ag3Sn and a more uniform Ag3Sn distribution in comparison with those of Sn57Bi1Ag solder. Nanoindentation test results show that the addition of Ag nanopowders has greatly enhanced the mechanical properties of Sn58Bi solder, i.e., it exhibits 13-30% increase in hardness and 10-22% increase in modulus of the composite solder. Besides, hardness and elastic modulus of solder are dependent on the size, distribution and the quantity of the second-phase.

AB - This paper presents the microstructure, hardness and elastic modulus of Sn58Bi, Sn57Bi1Ag and Ag nanopowders reinforced Sn58Bi composite solders. Microstructural observations reveal that the Ag nanopowders reinforced Sn58Bi composite solders have smaller grains of Ag3Sn and a more uniform Ag3Sn distribution in comparison with those of Sn57Bi1Ag solder. Nanoindentation test results show that the addition of Ag nanopowders has greatly enhanced the mechanical properties of Sn58Bi solder, i.e., it exhibits 13-30% increase in hardness and 10-22% increase in modulus of the composite solder. Besides, hardness and elastic modulus of solder are dependent on the size, distribution and the quantity of the second-phase.

UR - https://www.scopus.com/pages/publications/84902167381

M3 - 文章

AN - SCOPUS:84902167381

SN - 1330-9587

VL - 34

SP - 63

EP - 68

JO - Engineering Review

JF - Engineering Review

IS - 2

ER -

Effect of AG nanopowders on microstructure, hardness and elastic modulus of SN-BI solders

Abstract

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