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Effect of a void on the heat transfer in the head disk interface

  • Chuanwei Zhang*
  • , Alex Phan
  • , Young Woo Seo
  • , Andrey Ovcharenko
  • , Min Yang
  • , Frank E. Talke
  • *Corresponding author for this work
  • School of Mechatronics Engineering, Harbin Institute of Technology
  • University of California at San Diego
  • Western Digital

Research output: Contribution to journalArticlepeer-review

Abstract

The effect of a head void on the heat transfer in the air bearing between two parallel surfaces is investigated. The temperature distribution in the air bearing in the presence of the head void is calculated, and the heat flux in the air bearing is determined as a function of boundary pressure, boundary temperature, bottom surface velocity, and void size.

Original languageEnglish
Pages (from-to)2597-2603
Number of pages7
JournalMicrosystem Technologies
Volume21
Issue number12
DOIs
StatePublished - 1 Dec 2015
Externally publishedYes

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