@inproceedings{42b454f8005d4d1b8c43d77ed9c70188,
title = "Dynamic modeling and analysis of A 3-DOF parallel haptic device",
abstract = "This paper has developed a three degree-offreedom (3-DOF) haptic device which has adopted parallel structure. Compared with haptic devices adopting serial structure, parallel haptic devices have low inertia, high stiffness and can transfer large force or torque. Although parallel mechanism possess advantages above mentioned and other benefits, the presence of its closed-loop structure and redundant joints make it difficult to develop a dynamic model, which is essential in creating a model-based control strategy for the device. To establish a simple dynamic model that can be easily calculated in real time, the virtual work principle is used. After derivation of the kinematic and dynamic equations, simulation using ADAMS is conducted to verify the validity of dynamic model. Given that it is highly efficient and correct, the dynamic modeling can be used for real-time force feedback control.",
keywords = "Dynamic modeling, Haptic device, Kinematic analysis, Parallel mechanism",
author = "Fu Yili and Yang Yang and Pan Bo and Wang Shuguo",
year = "2013",
doi = "10.1109/ICMA.2013.6617902",
language = "英语",
isbn = "9781467355582",
series = "2013 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013",
publisher = "IEEE Computer Society",
pages = "110--115",
booktitle = "2013 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013",
address = "美国",
note = "2013 10th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013 ; Conference date: 04-08-2013 Through 07-08-2013",
}