Abstract
The indentation and scratch test were carried out for the single crystal silicon of brittle materials. The forms of brittle crack under various loads were investigated by metal optical microscope and scanning electron microscope. Based on the types of fracture behavior, the brittle-ductile transition cutting model in diamond turning of brittle materials was obtained. The reasonable explanation of brittle-ductile transition was given by using the energy theory of brittle fracture and ductile deformation.
| Original language | English |
|---|---|
| Pages (from-to) | 70-76 |
| Number of pages | 7 |
| Journal | Weixi Jiagong Jishu/Microfabrication Technology |
| Issue number | 4 |
| State | Published - 1998 |
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