Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow

Honglin Qian; Haotian Dai; Fanhong Chen; Shuai Liu; Xiaohui Du; Bing Li; Minjie Zhu; Gaopeng Xue

doi:10.1109/MEMS58180.2024.10439494

Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow

Honglin Qian
, Haotian Dai
, Fanhong Chen
, Shuai Liu
, Xiaohui Du
, Bing Li
, Minjie Zhu^*
, Gaopeng Xue^*

^*Corresponding author for this work

Harbin Institute of Technology Shenzhen
Instrumentation Technology and Economy Institute

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

This study innovatively proposed a microfabrication method of anodic bonding and glass thermal reflow for fabricating glass-based MEMS micro-hotplates with (through glass via) TGV structure. Compared with the conventionally adopted Si-based micro-hotplate, the glass-based micro-hotplate with smaller thermal conductivity coefficient (1.4 W/(m∗K)) leads to a lower power consumption. The glass-based micro-hotplate with insulation characteristic can directly support the micro-heater electrodes, and the conductive Si columns in TGV can replace the wire-bonder to realize the electrical interconnection with Integrated Circuit (IC). Finally, the fabricated glass-based micro-hotplates (0.196 mm2) can achieve a low power consumption of 80.4 mW at the target temperature of 305°C.

Original language	English
Title of host publication	IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	891-894
Number of pages	4
ISBN (Electronic)	9798350357929
DOIs	https://doi.org/10.1109/MEMS58180.2024.10439494
State	Published - 2024
Externally published	Yes
Event	37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024 - Austin, United States Duration: 21 Jan 2024 → 25 Jan 2024

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024
Country/Territory	United States
City	Austin
Period	21/01/24 → 25/01/24

Keywords

Anodic bonding
TGV
glass thermal reflow
glass-based micro-hotplate
low power consumption

Access to Document

10.1109/MEMS58180.2024.10439494

Cite this

Qian, H., Dai, H., Chen, F., Liu, S., Du, X., Li, B., Zhu, M., & Xue, G. (2024). Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow. In IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024 (pp. 891-894). (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMS58180.2024.10439494

Qian, Honglin ; Dai, Haotian ; Chen, Fanhong et al. / Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow. IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024. Institute of Electrical and Electronics Engineers Inc., 2024. pp. 891-894 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{f40fe9493c6e434881c17ce8216b0ab0,

title = "Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow",

abstract = "This study innovatively proposed a microfabrication method of anodic bonding and glass thermal reflow for fabricating glass-based MEMS micro-hotplates with (through glass via) TGV structure. Compared with the conventionally adopted Si-based micro-hotplate, the glass-based micro-hotplate with smaller thermal conductivity coefficient (1.4 W/(m∗K)) leads to a lower power consumption. The glass-based micro-hotplate with insulation characteristic can directly support the micro-heater electrodes, and the conductive Si columns in TGV can replace the wire-bonder to realize the electrical interconnection with Integrated Circuit (IC). Finally, the fabricated glass-based micro-hotplates (0.196 mm2) can achieve a low power consumption of 80.4 mW at the target temperature of 305°C.",

keywords = "Anodic bonding, TGV, glass thermal reflow, glass-based micro-hotplate, low power consumption",

author = "Honglin Qian and Haotian Dai and Fanhong Chen and Shuai Liu and Xiaohui Du and Bing Li and Minjie Zhu and Gaopeng Xue",

note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024 ; Conference date: 21-01-2024 Through 25-01-2024",

year = "2024",

doi = "10.1109/MEMS58180.2024.10439494",

language = "英语",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "891--894",

booktitle = "IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024",

address = "美国",

}

Qian, H, Dai, H, Chen, F, Liu, S, Du, X, Li, B, Zhu, M & Xue, G 2024, Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow. in IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Institute of Electrical and Electronics Engineers Inc., pp. 891-894, 37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024, Austin, United States, 21/01/24. https://doi.org/10.1109/MEMS58180.2024.10439494

Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow. / Qian, Honglin; Dai, Haotian; Chen, Fanhong et al.
IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024. Institute of Electrical and Electronics Engineers Inc., 2024. p. 891-894 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow

AU - Qian, Honglin

AU - Dai, Haotian

AU - Chen, Fanhong

AU - Liu, Shuai

AU - Du, Xiaohui

AU - Li, Bing

AU - Zhu, Minjie

AU - Xue, Gaopeng

PY - 2024

Y1 - 2024

N2 - This study innovatively proposed a microfabrication method of anodic bonding and glass thermal reflow for fabricating glass-based MEMS micro-hotplates with (through glass via) TGV structure. Compared with the conventionally adopted Si-based micro-hotplate, the glass-based micro-hotplate with smaller thermal conductivity coefficient (1.4 W/(m∗K)) leads to a lower power consumption. The glass-based micro-hotplate with insulation characteristic can directly support the micro-heater electrodes, and the conductive Si columns in TGV can replace the wire-bonder to realize the electrical interconnection with Integrated Circuit (IC). Finally, the fabricated glass-based micro-hotplates (0.196 mm2) can achieve a low power consumption of 80.4 mW at the target temperature of 305°C.

AB - This study innovatively proposed a microfabrication method of anodic bonding and glass thermal reflow for fabricating glass-based MEMS micro-hotplates with (through glass via) TGV structure. Compared with the conventionally adopted Si-based micro-hotplate, the glass-based micro-hotplate with smaller thermal conductivity coefficient (1.4 W/(m∗K)) leads to a lower power consumption. The glass-based micro-hotplate with insulation characteristic can directly support the micro-heater electrodes, and the conductive Si columns in TGV can replace the wire-bonder to realize the electrical interconnection with Integrated Circuit (IC). Finally, the fabricated glass-based micro-hotplates (0.196 mm2) can achieve a low power consumption of 80.4 mW at the target temperature of 305°C.

KW - Anodic bonding

KW - TGV

KW - glass thermal reflow

KW - glass-based micro-hotplate

KW - low power consumption

UR - https://www.scopus.com/pages/publications/85186714873

U2 - 10.1109/MEMS58180.2024.10439494

DO - 10.1109/MEMS58180.2024.10439494

M3 - 会议稿件

AN - SCOPUS:85186714873

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 891

EP - 894

BT - IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024

Y2 - 21 January 2024 through 25 January 2024

ER -

Qian H, Dai H, Chen F, Liu S, Du X, Li B et al. Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow. In IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024. Institute of Electrical and Electronics Engineers Inc. 2024. p. 891-894. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMS58180.2024.10439494

Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow

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Keywords

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