Development of chip-on-dot flip chip technique utilizing Gold Dot flexible circuitry

Z. P. Wang; Y. M. Tan; Christopher M. Schreiber; Christina C. Tsui; Z. F. Shi; J. Wei

Development of chip-on-dot flip chip technique utilizing Gold Dot flexible circuitry

Z. P. Wang^*
, Y. M. Tan
, Christopher M. Schreiber
, Christina C. Tsui
, Z. F. Shi
, J. Wei

^*Corresponding author for this work

Agency for Science, Technology and Research, Singapore

Research output: Contribution to journal › Conference article › peer-review

4 Scopus citations

Abstract

Using the PCMCIA card format, an electrically functional prototype was constructed and populated with 12 die using the chip-on-dot technique. Subsequently, the test vehicle was subjected to accelerated environmental testing. Results show that this assembly process is robust for commercial packaging applications.

Original language	English
Pages (from-to)	1470-1474
Number of pages	5
Journal	Proceedings - Electronic Components and Technology Conference
State	Published - 2000
Externally published	Yes

Cite this

@article{9047e2507f344677960c2051c90ef169,

title = "Development of chip-on-dot flip chip technique utilizing Gold Dot flexible circuitry",

abstract = "Using the PCMCIA card format, an electrically functional prototype was constructed and populated with 12 die using the chip-on-dot technique. Subsequently, the test vehicle was subjected to accelerated environmental testing. Results show that this assembly process is robust for commercial packaging applications.",

author = "Wang, \{Z. P.\} and Tan, \{Y. M.\} and Schreiber, \{Christopher M.\} and Tsui, \{Christina C.\} and Shi, \{Z. F.\} and J. Wei",

year = "2000",

language = "英语",

pages = "1470--1474",

journal = "Proceedings - Electronic Components and Technology Conference",

issn = "0569-5503",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - JOUR

T1 - Development of chip-on-dot flip chip technique utilizing Gold Dot flexible circuitry

AU - Wang, Z. P.

AU - Tan, Y. M.

AU - Schreiber, Christopher M.

AU - Tsui, Christina C.

AU - Shi, Z. F.

AU - Wei, J.

PY - 2000

Y1 - 2000

N2 - Using the PCMCIA card format, an electrically functional prototype was constructed and populated with 12 die using the chip-on-dot technique. Subsequently, the test vehicle was subjected to accelerated environmental testing. Results show that this assembly process is robust for commercial packaging applications.

AB - Using the PCMCIA card format, an electrically functional prototype was constructed and populated with 12 die using the chip-on-dot technique. Subsequently, the test vehicle was subjected to accelerated environmental testing. Results show that this assembly process is robust for commercial packaging applications.

UR - https://www.scopus.com/pages/publications/0034476183

M3 - 会议文章

AN - SCOPUS:0034476183

SN - 0569-5503

SP - 1470

EP - 1474

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

ER -

Development of chip-on-dot flip chip technique utilizing Gold Dot flexible circuitry

Abstract

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