TY - GEN
T1 - Development of a three-dimensional integrated solder ball bumping & bonding method for MEMS devices
AU - Yang, Lei
AU - Liu, Wei
AU - Wang, Chunqing
AU - Tian, Yanhong
PY - 2011
Y1 - 2011
N2 - Compared with integrated circuits, MEMS devices are more sophisticated and diverse. The complex non-planar micro components of MEMS devices raise the urgent needs for three-dimensional (3-D) packaging. To fulfill the specific needs in 3-D MEMS packaging, the basic concepts of a new 3-D integrated solder ball bumping & bonding method for MEMS devices was proposed. A prototype platform was developed according to the concepts with pads detection, micro solder ball manipulation, fluxless laser reflowing and bumps repairing processes. In the prototype platform, an improved center detection algorithm with the combination of the randomized Hough transform and the least squares method was integrated. The detecting tests indicated that the precision of the detecting algorithm can reach 0.21m, and its computing time was less than 10ms. With further experiments verification, solder bumping and microsensors packaging experiments were carried out.
AB - Compared with integrated circuits, MEMS devices are more sophisticated and diverse. The complex non-planar micro components of MEMS devices raise the urgent needs for three-dimensional (3-D) packaging. To fulfill the specific needs in 3-D MEMS packaging, the basic concepts of a new 3-D integrated solder ball bumping & bonding method for MEMS devices was proposed. A prototype platform was developed according to the concepts with pads detection, micro solder ball manipulation, fluxless laser reflowing and bumps repairing processes. In the prototype platform, an improved center detection algorithm with the combination of the randomized Hough transform and the least squares method was integrated. The detecting tests indicated that the precision of the detecting algorithm can reach 0.21m, and its computing time was less than 10ms. With further experiments verification, solder bumping and microsensors packaging experiments were carried out.
UR - https://www.scopus.com/pages/publications/81355123668
U2 - 10.1109/ICEPT.2011.6066935
DO - 10.1109/ICEPT.2011.6066935
M3 - 会议稿件
AN - SCOPUS:81355123668
SN - 9781457717680
T3 - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
SP - 729
EP - 732
BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
Y2 - 8 August 2011 through 11 August 2011
ER -