TY - GEN
T1 - Design of the AXIe instrument module interfacing component
AU - Jiaqing, Qiao
AU - Jia, Xianzhao
AU - Zhao, Xinyu
AU - Lei, Feng
AU - Zheng, Wenbin
AU - Fu, Ping
AU - Zhu, Minglong
AU - Yin, Hongtao
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/5
Y1 - 2017/7/5
N2 - AXIe is a new standard for test and measurement. It provides an open, high-performance platform for instrument module. In order to reduce the complexity of developing AXIe instrument module, the authors designed an interface component by taking a FPGA as core controller. The component implements an AXIe interface and two High Speed Mezzanine Card (HSMC) interfaces which are used to connect different functional modules. The Qsys tool is introduced into logic design to present a series of interface subsystems aiming at various applications. Using the suite, designers could skip the AXIe interface design and focus on the design of module's function. In addition, designers can also take advantage of the commercial off-the-shelf(COTS) HSMC modules, which will be help establishing an automatic test system rapidly.
AB - AXIe is a new standard for test and measurement. It provides an open, high-performance platform for instrument module. In order to reduce the complexity of developing AXIe instrument module, the authors designed an interface component by taking a FPGA as core controller. The component implements an AXIe interface and two High Speed Mezzanine Card (HSMC) interfaces which are used to connect different functional modules. The Qsys tool is introduced into logic design to present a series of interface subsystems aiming at various applications. Using the suite, designers could skip the AXIe interface design and focus on the design of module's function. In addition, designers can also take advantage of the commercial off-the-shelf(COTS) HSMC modules, which will be help establishing an automatic test system rapidly.
UR - https://www.scopus.com/pages/publications/85026838546
U2 - 10.1109/I2MTC.2017.7969923
DO - 10.1109/I2MTC.2017.7969923
M3 - 会议稿件
AN - SCOPUS:85026838546
T3 - I2MTC 2017 - 2017 IEEE International Instrumentation and Measurement Technology Conference, Proceedings
BT - I2MTC 2017 - 2017 IEEE International Instrumentation and Measurement Technology Conference, Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2017
Y2 - 22 May 2017 through 25 May 2017
ER -