TY - GEN
T1 - Design of tactile sensor for measuring orthocenter deviation and friction in wafer transmission process
AU - Wu, Jiang
AU - Liu, Yanjie
AU - Han, Haijun
AU - Sun, Lining
PY - 2012
Y1 - 2012
N2 - In order to raise position accuracy and stability in wafer transmission process, a tactile sensing system which can measure both deviation of wafer to manipulator and friction acting on wafer simultaneously is introduced. Analysis on kinetic model abstracted from sensing system is made, and following algorithms are applied: micro displacement is calculated through pressure values acting on different sensing units, and meanwhile friction is calculated from relative velocity between permanent magnet and inductance. Through simulation, indicators of sensing unit are established. This sensing system has the capacity of detecting deviation ranging 0-5 mm with resolution 0.05 mm and measure friction ranging 0-0.64 N. The results indicate that this sensing system meets the requirements in orthocenter deviation and friction measurement in wafer transmission process.
AB - In order to raise position accuracy and stability in wafer transmission process, a tactile sensing system which can measure both deviation of wafer to manipulator and friction acting on wafer simultaneously is introduced. Analysis on kinetic model abstracted from sensing system is made, and following algorithms are applied: micro displacement is calculated through pressure values acting on different sensing units, and meanwhile friction is calculated from relative velocity between permanent magnet and inductance. Through simulation, indicators of sensing unit are established. This sensing system has the capacity of detecting deviation ranging 0-5 mm with resolution 0.05 mm and measure friction ranging 0-0.64 N. The results indicate that this sensing system meets the requirements in orthocenter deviation and friction measurement in wafer transmission process.
KW - Friction measurement
KW - Micro displacement measurements
KW - Tactile sensor
KW - Wafer transmission
UR - https://www.scopus.com/pages/publications/84859040586
U2 - 10.4028/www.scientific.net/AMR.488-489.1752
DO - 10.4028/www.scientific.net/AMR.488-489.1752
M3 - 会议稿件
AN - SCOPUS:84859040586
SN - 9783037853825
T3 - Advanced Materials Research
SP - 1752
EP - 1756
BT - Key Engineering Materials II
T2 - 2012 2nd International Conference on Key Engineering Materials, ICKEM 2012
Y2 - 26 February 2012 through 28 February 2012
ER -