Design of micro-gripper in wire bond based on piezoelectric material

Zhili Long; Mouyang Liu; Jianguo Zhang

Design of micro-gripper in wire bond based on piezoelectric material

Zhili Long^*
, Mouyang Liu
, Jianguo Zhang

^*Corresponding author for this work

Harbin Institute of Technology Shenzhen
Huazhong University of Science and Technology

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

Micro-gripper is a key component in IC/LED wire bonder. A nonnative gripper combined with piezoelectric material and flexible structure is presented in this paper. The vibration modal and static characteristics of this gripper are calculated by finite element method. The natural frequency and vibration modal of the system; and the open amplitude of this gripper are attained. In the experiment, the high-speed camera is used to track the vibration of the gripper, and the relationship between the open amplitude and the driven voltage is attained. The vibration behavior is collected by a non-contact laser to verify the FEM calculations. These results can help to the application of this gripper used in wire bond.

Original language	English
Pages (from-to)	853-856
Number of pages	4
Journal	Yadian Yu Shengguang/Piezoelectrics and Acoustooptics
Volume	34
Issue number	6
State	Published - Dec 2012
Externally published	Yes

Keywords

Flexible structure
Micro-gripper
Piezoelectric smart material
Wire bonding

Cite this

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title = "Design of micro-gripper in wire bond based on piezoelectric material",

abstract = "Micro-gripper is a key component in IC/LED wire bonder. A nonnative gripper combined with piezoelectric material and flexible structure is presented in this paper. The vibration modal and static characteristics of this gripper are calculated by finite element method. The natural frequency and vibration modal of the system; and the open amplitude of this gripper are attained. In the experiment, the high-speed camera is used to track the vibration of the gripper, and the relationship between the open amplitude and the driven voltage is attained. The vibration behavior is collected by a non-contact laser to verify the FEM calculations. These results can help to the application of this gripper used in wire bond.",

keywords = "Flexible structure, Micro-gripper, Piezoelectric smart material, Wire bonding",

author = "Zhili Long and Mouyang Liu and Jianguo Zhang",

year = "2012",

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volume = "34",

pages = "853--856",

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T1 - Design of micro-gripper in wire bond based on piezoelectric material

AU - Long, Zhili

AU - Liu, Mouyang

AU - Zhang, Jianguo

PY - 2012/12

Y1 - 2012/12

N2 - Micro-gripper is a key component in IC/LED wire bonder. A nonnative gripper combined with piezoelectric material and flexible structure is presented in this paper. The vibration modal and static characteristics of this gripper are calculated by finite element method. The natural frequency and vibration modal of the system; and the open amplitude of this gripper are attained. In the experiment, the high-speed camera is used to track the vibration of the gripper, and the relationship between the open amplitude and the driven voltage is attained. The vibration behavior is collected by a non-contact laser to verify the FEM calculations. These results can help to the application of this gripper used in wire bond.

AB - Micro-gripper is a key component in IC/LED wire bonder. A nonnative gripper combined with piezoelectric material and flexible structure is presented in this paper. The vibration modal and static characteristics of this gripper are calculated by finite element method. The natural frequency and vibration modal of the system; and the open amplitude of this gripper are attained. In the experiment, the high-speed camera is used to track the vibration of the gripper, and the relationship between the open amplitude and the driven voltage is attained. The vibration behavior is collected by a non-contact laser to verify the FEM calculations. These results can help to the application of this gripper used in wire bond.

KW - Flexible structure

KW - Micro-gripper

KW - Piezoelectric smart material

KW - Wire bonding

UR - https://www.scopus.com/pages/publications/84872229156

M3 - 文章

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VL - 34

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JO - Yadian Yu Shengguang/Piezoelectrics and Acoustooptics

JF - Yadian Yu Shengguang/Piezoelectrics and Acoustooptics

IS - 6

ER -

Design of micro-gripper in wire bond based on piezoelectric material

Abstract

Keywords

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