@inproceedings{c97c875778b1463588fb0b690c1530c2,
title = "Design of laser scanning solder bumping system",
abstract = "In this paper, various laser scanning methods were presented. A new and promising laser scanning method was discussed, and the principle of the laser scanning reflow system was illustrated. With this system, laser scanning reflow experiments of PBGA solder balls were carried out. Results of experiments showed that laser scanning reflow of PBGA solder balls could be realized with a wide parameter window. The formation of the solder bump is strongly influenced by laser input energy. With proper laser input energy, solder bumps with a smooth surface, high shear strength and fine microstructure could be obtained.",
keywords = "Electronics packaging, Focusing, Laser beams, Laser theory, Microstructure, Optical design, Optical modulation, Soldering, Surface emitting lasers, Testing",
author = "Xiaodong Zhang and Chunqing Wang and Yanhong Tian",
note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 5th International Conference on Electronic Packaging Technology, ICEPT 2003 ; Conference date: 28-10-2003 Through 30-10-2003",
year = "2003",
doi = "10.1109/EPTC.2003.1298710",
language = "英语",
series = "ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "141--144",
editor = "Keyun Bi and Barnwell, \{Peter G.\} and Jiaji Wang",
booktitle = "ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings",
address = "美国",
}