TY - GEN
T1 - Design and simulation of a macro-micro dual-drive high acceleration precision XY-stage for IC bonding technology
AU - Jie, Degang
AU - Sun, Lining
AU - Liu, Yanjie
AU - Znu, Yunong
AU - Cai, Hegao
PY - 2005
Y1 - 2005
N2 - A macro-micro dual-drive high acceleration precision XY-stage is presented in this paper. Combining macro with micro actuator, a system of large workspace and high acceleration with high resolution of motion is developed. Two linear voice coil motors (VCM) are used into the macro motion, and two PZT-driven micro stages of high frequency are mounted on each motor to compensate the position error. A novel elastic decoupling mechanism is used in the stage to avoid the moving gap. The high resolution linear encoder is integrated into the closed-loop feedback, which is used to measure the position of the output end of macro stage and micro stage. By using the mechanical dynamic simulation and FEA method, the decoupling mechanism and the micro mechanism are optimized, and the dynamic characteristics of the high acceleration stage are investigated, which is based on the rigid-flexible dynamic analysis of mechanical system. The simulation results show that this new configuration allows a workspace of 25×25mm2 and an acceleration exceeding 100m/s2 with a resolution of motion better than 10nm. The improved significantly performance of the XY-stage can meet the requirement of the rapid development of IC bonding technology.
AB - A macro-micro dual-drive high acceleration precision XY-stage is presented in this paper. Combining macro with micro actuator, a system of large workspace and high acceleration with high resolution of motion is developed. Two linear voice coil motors (VCM) are used into the macro motion, and two PZT-driven micro stages of high frequency are mounted on each motor to compensate the position error. A novel elastic decoupling mechanism is used in the stage to avoid the moving gap. The high resolution linear encoder is integrated into the closed-loop feedback, which is used to measure the position of the output end of macro stage and micro stage. By using the mechanical dynamic simulation and FEA method, the decoupling mechanism and the micro mechanism are optimized, and the dynamic characteristics of the high acceleration stage are investigated, which is based on the rigid-flexible dynamic analysis of mechanical system. The simulation results show that this new configuration allows a workspace of 25×25mm2 and an acceleration exceeding 100m/s2 with a resolution of motion better than 10nm. The improved significantly performance of the XY-stage can meet the requirement of the rapid development of IC bonding technology.
UR - https://www.scopus.com/pages/publications/33846284497
U2 - 10.1109/ICEPT.2005.1564689
DO - 10.1109/ICEPT.2005.1564689
M3 - 会议稿件
AN - SCOPUS:33846284497
SN - 0780394496
SN - 9780780394490
T3 - 2005 6th International Conference on Electronics Packaging Technology
SP - 161
EP - 165
BT - 2005 6th International Conference on Electronics Packaging Technology
PB - IEEE Computer Society
T2 - 2005 6th International Conference on Electronics Packaging Technology
Y2 - 30 August 2005 through 2 September 2005
ER -