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Design and experiment of the wafer pre-alignment system

  • Dongsheng Qu*
  • , Suilong Qiao
  • , Weibin Rong
  • , Yixu Song
  • , Yannan Zhao
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The wafer pre-alignment system is a fundamental part of the lithography. A system for automated pre-alignment of wafer with a diameter of 8 inches is developed. The system consists of three functional units that can achieve the pre-alignment task with high efficiency and high precision, including positioning unit, transporting manipulator and transferring unit. The requirement of positioning and transportation accuracy (less than 7pm) is essential to design and development of integrated system due to the high precision of IC manufacturing. In this paper, a liner CCD camera with a resolution of 0.1pm is used to detect the wafer edge and the notch. Major methodology issues, including Least Square circle fitting approach for calculating the center and radius of the wafer, an edge flexion method for detecting the range of wafer notch, of alignment strategies are introduced. The experimental results show that the accuracy of the wafer notch detection is 3.49pm and the overall accuracy of wafer positioning is 6.11pm.

Original languageEnglish
Title of host publicationProceedings of the 2007 IEEE International Conference on Mechatronics and Automation, ICMA 2007
Pages1483-1488
Number of pages6
DOIs
StatePublished - 2007
Event2007 IEEE International Conference on Mechatronics and Automation, ICMA 2007 - Harbin, China
Duration: 5 Aug 20078 Aug 2007

Publication series

NameProceedings of the 2007 IEEE International Conference on Mechatronics and Automation, ICMA 2007

Conference

Conference2007 IEEE International Conference on Mechatronics and Automation, ICMA 2007
Country/TerritoryChina
CityHarbin
Period5/08/078/08/07

Keywords

  • Notch detection
  • Pre-alignment
  • Wafer
  • Wafer centering

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