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Design and analysis of a piezostack driven jetting dispenser for high viscosity adhesives

  • Harbin Institute of Technology
  • Harbin Institute of Technology Weihai

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The paper presents a new type of piezostack driven jetting dispenser, which can be applied to dispense high viscosity adhesives in microelectronic packaging process. According to the bond graph technique, a dynamic model and governing equations are derived from integrating the sub-models of the electromechanical part and the fluid part of the dispenser. Based on the proposed model, the jetting dispenser is manufactured, and its performance is then evaluated through both computer simulation and experimental investigation. The results verify the dispenser's jetting ability and the model's validity, and provide support for the design and control studies of the proposed dispenser.

Original languageEnglish
Title of host publicationAIM 2014 - IEEE/ASME International Conference on Advanced Intelligent Mechatronics
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages227-232
Number of pages6
ISBN (Print)9781479957361
DOIs
StatePublished - 2014
Event2014 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2014 - Besancon, France
Duration: 8 Jul 201411 Jul 2014

Publication series

NameIEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM

Conference

Conference2014 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2014
Country/TerritoryFrance
CityBesancon
Period8/07/1411/07/14

Keywords

  • bond graph
  • high viscosity
  • jetting dispenser
  • piezostack

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