TY - GEN
T1 - Depiction of the elastic anisotropy of AuSn4 and AuSn2 from first-principles calculations
AU - An, Rong
AU - Wang, Chunqing
AU - Tian, Yanhong
PY - 2009
Y1 - 2009
N2 - As the solder joints become increasingly small and contain only a few grains, their mechanical properties cannot be determined from conventional mechanical tests as with bulk samples, and there may be a considerable variation in mechanical behavior from joint to joint because of the anisotropy of mechanical properties. In this paper, elastic constants of single-crystal AuSn4 and AuSn2 were preliminarily determined through first-principles calculations to characterize their polycrystalline elastic behavior and elastic anisotropy. The ideal bulk, shear, and Young's moduli, as well as Poisson's ratios were determined using the Voigt-Reuss-Hill method. These compounds exhibited distinct anisotropy in Young's modulus, which may be partially responsible for the discrepancy in the experimental results.
AB - As the solder joints become increasingly small and contain only a few grains, their mechanical properties cannot be determined from conventional mechanical tests as with bulk samples, and there may be a considerable variation in mechanical behavior from joint to joint because of the anisotropy of mechanical properties. In this paper, elastic constants of single-crystal AuSn4 and AuSn2 were preliminarily determined through first-principles calculations to characterize their polycrystalline elastic behavior and elastic anisotropy. The ideal bulk, shear, and Young's moduli, as well as Poisson's ratios were determined using the Voigt-Reuss-Hill method. These compounds exhibited distinct anisotropy in Young's modulus, which may be partially responsible for the discrepancy in the experimental results.
UR - https://www.scopus.com/pages/publications/70449981780
U2 - 10.1109/ICEPT.2009.5270675
DO - 10.1109/ICEPT.2009.5270675
M3 - 会议稿件
AN - SCOPUS:70449981780
SN - 9781424446599
T3 - 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
SP - 611
EP - 616
BT - 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
T2 - 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Y2 - 10 August 2009 through 13 August 2009
ER -