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Deformation behavior and microstructure evolution of 7050 aluminum alloy during high temperature deformation

  • H. E. Hu
  • , L. Zhen*
  • , L. Yang
  • , W. Z. Shao
  • , B. Y. Zhang
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Deformation behavior and microstructure evolution of 7050 aluminum alloy were investigated by tensile tests conducted at different temperatures (340, 380, 420, and 460 °C) with different strain rates of 1.0 × 10-4, 1.0 × 10-3, 1.0 × 10-2 and 0.1 s-1. The results show that the stress level of the alloy can be presented by a Zener-Holloman parameter in a hyperbolic sine-type equation with the hot activation energy of 256.6 kJ/mol. Ductile transgranular fracture transforms progressively into ductile intergranular (or inter-subgranular) fracture with the decrease of Z value. At the same time, the soften mechanism of the alloy during high temperature deformation transforms from dynamic recovery to continuous dynamic recrystallization with decreasing Z value. The main deformation mechanism is usual slipping when the alloy was deformed at high Z value. Grain boundaries sliding takes part in deformation with low Z value. Grain boundaries migration plays the role with medium Z value.

Original languageEnglish
Pages (from-to)64-71
Number of pages8
JournalMaterials Science and Engineering: A
Volume488
Issue number1-2
DOIs
StatePublished - 15 Aug 2008
Externally publishedYes

Keywords

  • Aluminum alloy
  • EBSD
  • High temperature deformation
  • Microstructure

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