TY - GEN
T1 - Defect classification algorithm for IC photomask based on PCA and SVM
AU - Chen, Shizhe
AU - Hu, Tao
AU - Liu, Guodong
AU - Pu, Zhaobang
AU - Li, Min
AU - Du, Libin
PY - 2008
Y1 - 2008
N2 - During IC photomask vision inspection, considering problem that fine image defect's fineness, complex shape, extraction feature difficultly, and effect by noise easily, presented defect identification classification algorithm based on PCA(Principal Components Analysis) and SVM(Support Vector Machine). It resolved the problem that fine and complex defect was difficult to classify, by merits of the extracting image global feature with PCA, and high accuracy and generalization capability with SVM. Regard class-distance as criterion to construct the binary tree in multi-class SVM classification algorithm. It resolved the problem that the structure of binary tree affected the accuracy of classifier, and upgraded defect classification accuracy finally. Experiments show that six defects classification accuracy by this method is up to 97.8%, higher than best accuracy 93.3% by BP network and 83.3% by method based on region. And the training and inspecting time is few. In result, it's an effective method for fineness defect identification and classification.
AB - During IC photomask vision inspection, considering problem that fine image defect's fineness, complex shape, extraction feature difficultly, and effect by noise easily, presented defect identification classification algorithm based on PCA(Principal Components Analysis) and SVM(Support Vector Machine). It resolved the problem that fine and complex defect was difficult to classify, by merits of the extracting image global feature with PCA, and high accuracy and generalization capability with SVM. Regard class-distance as criterion to construct the binary tree in multi-class SVM classification algorithm. It resolved the problem that the structure of binary tree affected the accuracy of classifier, and upgraded defect classification accuracy finally. Experiments show that six defects classification accuracy by this method is up to 97.8%, higher than best accuracy 93.3% by BP network and 83.3% by method based on region. And the training and inspecting time is few. In result, it's an effective method for fineness defect identification and classification.
KW - Class-distance
KW - Defect classification
KW - IC photomask
KW - PCA
KW - SVM
UR - https://www.scopus.com/pages/publications/51849149932
U2 - 10.1109/CISP.2008.177
DO - 10.1109/CISP.2008.177
M3 - 会议稿件
AN - SCOPUS:51849149932
SN - 9780769531199
T3 - Proceedings - 1st International Congress on Image and Signal Processing, CISP 2008
SP - 491
EP - 496
BT - Proceedings - 1st International Congress on Image and Signal Processing, CISP 2008
T2 - 1st International Congress on Image and Signal Processing, CISP 2008
Y2 - 27 May 2008 through 30 May 2008
ER -