Abstract
HfO2-based ferroelectrics attract considerable attention as their nanoscale ferroelectricity and CMOS compatibility, fulfilling demands of emerging memory technologies. However, as films scale down, resistive-switching behavior becomes increasingly pronounced, intertwining with polarization-switching process and affecting ferroelectric switching—factors often overlooked yet crucial for device optimization. Characterizing resistive-switching behavior and oxygen vacancy motion using tailored electric-pulse schemes, we decouple the resistive-switching behavior from the overall switching process in ultrathin Hf0.5Zr0.5O2 films, which would otherwise erroneously inflate polarization values and increase coercive fields. Building on this, we elucidate endurance degradation mechanisms from perspectives of resistive switching and defect migration. Furthermore, we demonstrate mitigated resistive-switching activity by designing HfO2-based devices with symmetric oxide electrodes, achieving reduced coercive fields and improved cycling performances. This work provides crucial insights into origins of inflated polarizations and reliability challenges in HfO2-based devices while offering a viable strategy to enhance ferroelectric properties for advanced applications.
| Original language | English |
|---|---|
| Article number | 102726 |
| Journal | Matter |
| DOIs | |
| State | Accepted/In press - 2026 |
| Externally published | Yes |
Keywords
- HfO thin films
- polarization values
- polarization-switching
- reliability performances
- resistive-switching
- ultrathin ferroelectric films
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