TY - GEN
T1 - Current research progress in non-classical fourier heat conduction
AU - Wang, Fei Fei
AU - Wang, B.
PY - 2014
Y1 - 2014
N2 - Classical Fourier law can accurately describe most heat conduction problems. But for ultrafast heat conduction process and micro/nanoscale heat conduction problems, non-classical Fourier (non-Fourier) effect may become dominated. The paper gives a review on the current progress on non-Fourier heat conduction in engineering. It includes basic concept, physical models, thermal relaxation effect, and related experiments. Also introduced are the solution methods of non-Fourier heat conduction equations, including closed-form solution, finite difference method, finite element method, molecular dynamics simulation, variational method, and other hybrid methods. Some challenging issues are discussed at the conclusion of the paper.
AB - Classical Fourier law can accurately describe most heat conduction problems. But for ultrafast heat conduction process and micro/nanoscale heat conduction problems, non-classical Fourier (non-Fourier) effect may become dominated. The paper gives a review on the current progress on non-Fourier heat conduction in engineering. It includes basic concept, physical models, thermal relaxation effect, and related experiments. Also introduced are the solution methods of non-Fourier heat conduction equations, including closed-form solution, finite difference method, finite element method, molecular dynamics simulation, variational method, and other hybrid methods. Some challenging issues are discussed at the conclusion of the paper.
KW - Analysis solution
KW - Non-fourier heat conduction
KW - Numerical solution
KW - Relaxation effect
UR - https://www.scopus.com/pages/publications/84887287445
U2 - 10.4028/www.scientific.net/AMM.442.187
DO - 10.4028/www.scientific.net/AMM.442.187
M3 - 会议稿件
AN - SCOPUS:84887287445
SN - 9783037859018
T3 - Applied Mechanics and Materials
SP - 187
EP - 196
BT - Materials Engineering and Mechanical Automation
T2 - 3rd International Conference on Computer-Aided Design, Manufacturing, Modeling and Simulation, CDMMS 2013
Y2 - 21 September 2013 through 23 September 2013
ER -