Skip to main navigation Skip to search Skip to main content

Crosstalk analysis of carbon nanotube bundle interconnects

  • Kailiang Zhang*
  • , Bo Tian
  • , Xiaosong Zhu
  • , Fang Wang
  • , Jun Wei
  • *Corresponding author for this work
  • Tianjin University of Technology
  • Agency for Science, Technology and Research, Singapore

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, the interconnect parameters for a carbon nanotube (CNT) bundle are calculated first, then the equivalent circuit has been developed to perform the crosstalk analysis and in the end the main influencing factors are discussed. On the basis of simulation which is completed by simulation software SPICE, crosstalk voltage can be decreased by increasing spacing between adjacent lines, setting the appropriate position when the length is fixed, decreasing line length and selecting the appropriate frequency.

Original languageEnglish
Title of host publication4th IEEE International NanoElectronics Conference, INEC 2011
DOIs
StatePublished - 2011
Externally publishedYes
Event4th IEEE International Nanoelectronics Conference, INEC 2011 - Tao-Yuan, Taiwan, Province of China
Duration: 21 Jun 201124 Jun 2011

Publication series

NameProceedings - International NanoElectronics Conference, INEC
ISSN (Print)2159-3523

Conference

Conference4th IEEE International Nanoelectronics Conference, INEC 2011
Country/TerritoryTaiwan, Province of China
CityTao-Yuan
Period21/06/1124/06/11

Keywords

  • SPICE
  • carbon nanotube (CNT)
  • crosstalk
  • interconnects
  • nanotechnology

Fingerprint

Dive into the research topics of 'Crosstalk analysis of carbon nanotube bundle interconnects'. Together they form a unique fingerprint.

Cite this