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Corrigendum to “The peeling behavior of film/substrate systems with periodic and discontinuous bonding”(Engineering Fracture Mechanics, (2024), 310, C, (110518), (S0013794424006817), 10.1016/j.engfracmech.2024.110518)

  • Harbin Institute of Technology

Research output: Contribution to journalComment/debate

Abstract

The authors regret that an error was made in 3.1 finite element verification. In the finite element simulations, the correct boundary condition is to apply the displacement at the midpoint of the right surface of the beam, rather than over the entire right surface. The latter incorrectly imposes an additional rotational boundary condition, θ(l + Δ + L) = 0, thereby causing an excessively large discrepancy between the theoretical predictions and the finite element results in the finite deformation framework. Therefore, Fig. 6 has been corrected as follows:(Figure presented) Fig. 6. Comparison results for theory and FE simulation: (a)–(c) for different bonding ratios; (d)–(f) for different bonding periods. The authors would like to apologise for any inconvenience caused.

Original languageEnglish
Article number112189
JournalEngineering Fracture Mechanics
Volume340
DOIs
StatePublished - 27 Jun 2026
Externally publishedYes

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