Skip to main navigation Skip to search Skip to main content

Contact reactive joining of TA15 and 304 stainless steel via a copper interlayer heated by electron beam with a beam deflection

  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

TA15 titanium alloy and 304 stainless steel were joined via a copper interlayer heated by electron beam with a beam deflection towards the stainless steel. Microstructures of the joints were analyzed by optical microscopy, scanning electron microscopy, and X-ray diffraction. The tensile strengths of the joints and the ultramicrohardness of the intermetallic compounds were also measured. The results showed that the joint was formed by three kinds of metallurgical processes. Copper interlayer and TA15 were joined by contact reaction with the reaction products of CuTi, Cu4Ti3, and Cu2Ti. While copper interlayer and 304 stainless steel were joined by fusion and solid state diffusion process. Tensile strength of the joint can reach to 300 MPa, equivalent to 55% of that of 304 stainless steel. Furthermore, the tensile strength was mostly dependent on the volume of the unmelted copper sheet, although the intermetallics layer was the weakest location in the joint.

Original languageEnglish
Pages (from-to)2067-2073
Number of pages7
JournalJournal of Materials Engineering and Performance
Volume21
Issue number10
DOIs
StatePublished - Oct 2012

Keywords

  • 304 stainless steel
  • Beam deflection
  • Electron beam
  • Microstructure
  • TA15 titanium alloy
  • Ultramicrohardness

Fingerprint

Dive into the research topics of 'Contact reactive joining of TA15 and 304 stainless steel via a copper interlayer heated by electron beam with a beam deflection'. Together they form a unique fingerprint.

Cite this