Skip to main navigation Skip to search Skip to main content

Computational framework for the simulation of multi material laser powder bed fusion

  • Chao Tang*
  • , Liming Yao
  • , Hejun Du
  • *Corresponding author for this work
  • Nanyang Technological University

Research output: Contribution to journalArticlepeer-review

Abstract

With the capability to build components with freeform geometries, laser powder bed fusion (L-PBF) is considered as one of the most promising techniques for industrial applications. Compared to conventional manufacturing technologies, an additional advantage of L-PBF process is the capability to fabricate parts with multiple materials, such as in-situ alloying and functionally graded alloys. In this regard, here we present a computational model to simulate the L-PBF of multiple materials. Based on volume of fluid (VOF) methods and computational fluid dynamics (CFD), the multi-physics multi-material model was successfully implemented with various physics of L-PBF process, including surface tension, Marangoni shear force, recoil pressure, compositional diffusion, etc. In addition, we demonstrated the numerical algorithm of ray tracing heat source for multiple materials. With reasonable assumptions, conduction mode or keyhole mode laser melting of miscible materials can be simulated via the proposed computational framework. Furthermore, such multi-physics model is capable of simulating L-PBF of an arbitrary number of materials. The computational model can help achieve insightful understanding of the L-PBF of multiple materials.

Original languageEnglish
Article number122855
JournalInternational Journal of Heat and Mass Transfer
Volume191
DOIs
StatePublished - 1 Aug 2022
Externally publishedYes

Keywords

  • Additive manufacturing
  • Computer simulations
  • In situ alloying
  • Laser powder bed fusion
  • Multiple materials

Fingerprint

Dive into the research topics of 'Computational framework for the simulation of multi material laser powder bed fusion'. Together they form a unique fingerprint.

Cite this