Communication–A High-Efficiency and Low-Damage Treatment for Pressure Less Sintering of Ag Micro-Nano Particles at Low Temperature

Pressure-free and low-damage interconnections are essential for high-density packaging of high-power devices. Here, a novel and high-efficient plasma treatment method to sinter micro-nano particles at low temperature without pressure is discussed. The silver paste was exposed to Ar/H₂ plasma for only 10 s, followed by sintering at 200 ℃ for 15 min. The shear strength increased to 2.6 times that of the untreated sample. Improvements in the sheet resistivity and thermal conductivity were observed. Ar/H₂ plasma treatment is a viable approach for enhancing the sintering performance of commercially available silver pastes, thereby contributing to advancements in packaging technology.