Characterization of Al/Ni multilayers and their application in diffusion bonding of TiAl to TiC cermet

J. Cao; X. G. Song; L. Z. Wu; J. L. Qi; J. C. Feng

doi:10.1016/j.tsf.2012.01.001

Characterization of Al/Ni multilayers and their application in diffusion bonding of TiAl to TiC cermet

J. Cao^*
, X. G. Song
, L. Z. Wu
, J. L. Qi
, J. C. Feng

^*Corresponding author for this work

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

48 Scopus citations

Abstract

The Al/Ni multilayers were characterized and diffusion bonding of TiAl intermetallics to TiC cermets was carried out using the multilayers. The microstructure of Al/Ni multilayers and TiAl/TiC cermet joint was investigated. The layered structures consisting of a Ni ₃(AlTi) layer, a Ni ₂AlTi layer, a (Ni,Al,Ti) layer and a Ni diffusion layer were observed from the interlayer to the TiAl substrate. Only one AlNi ₃ layer formed at the multilayer/TiC cermet interface. The reaction behaviour of Al/Ni multilayers was characterized by means of differential scanning calorimeter (DSC) and X-ray diffraction. The initial exothermic peak of the DSC curve was formed due to the formation of Al ₃Ni and Al ₃Ni ₂ phases. The reaction sequence of the Al/Ni multilayers was Al ₃Ni → Al ₃Ni ₂ → AlNi → AlNi ₃ and the final products were AlNi and AlNi ₃ phases. The shear strength of the joint was tested and the experimental results suggested that the application of Al/Ni multilayers improved the joining quality.

Original language	English
Pages (from-to)	3528-3531
Number of pages	4
Journal	Thin Solid Films
Volume	520
Issue number	9
DOIs	https://doi.org/10.1016/j.tsf.2012.01.001
State	Published - 29 Feb 2012

Keywords

Al/Ni multilayer
Diffusion bonding
Microstructure
Reaction
Scanning electron microscopy

Access to Document

10.1016/j.tsf.2012.01.001

Cite this

@article{043500de26624284b89935b4ccfafa10,

title = "Characterization of Al/Ni multilayers and their application in diffusion bonding of TiAl to TiC cermet",

abstract = "The Al/Ni multilayers were characterized and diffusion bonding of TiAl intermetallics to TiC cermets was carried out using the multilayers. The microstructure of Al/Ni multilayers and TiAl/TiC cermet joint was investigated. The layered structures consisting of a Ni 3(AlTi) layer, a Ni 2AlTi layer, a (Ni,Al,Ti) layer and a Ni diffusion layer were observed from the interlayer to the TiAl substrate. Only one AlNi 3 layer formed at the multilayer/TiC cermet interface. The reaction behaviour of Al/Ni multilayers was characterized by means of differential scanning calorimeter (DSC) and X-ray diffraction. The initial exothermic peak of the DSC curve was formed due to the formation of Al 3Ni and Al 3Ni 2 phases. The reaction sequence of the Al/Ni multilayers was Al 3Ni → Al 3Ni 2 → AlNi → AlNi 3 and the final products were AlNi and AlNi 3 phases. The shear strength of the joint was tested and the experimental results suggested that the application of Al/Ni multilayers improved the joining quality.",

keywords = "Al/Ni multilayer, Diffusion bonding, Microstructure, Reaction, Scanning electron microscopy",

author = "J. Cao and Song, \{X. G.\} and Wu, \{L. Z.\} and Qi, \{J. L.\} and Feng, \{J. C.\}",

year = "2012",

month = feb,

day = "29",

doi = "10.1016/j.tsf.2012.01.001",

language = "英语",

volume = "520",

pages = "3528--3531",

journal = "Thin Solid Films",

issn = "0040-6090",

publisher = "Elsevier B.V.",

number = "9",

}

TY - JOUR

T1 - Characterization of Al/Ni multilayers and their application in diffusion bonding of TiAl to TiC cermet

AU - Cao, J.

AU - Song, X. G.

AU - Wu, L. Z.

AU - Qi, J. L.

AU - Feng, J. C.

PY - 2012/2/29

Y1 - 2012/2/29

N2 - The Al/Ni multilayers were characterized and diffusion bonding of TiAl intermetallics to TiC cermets was carried out using the multilayers. The microstructure of Al/Ni multilayers and TiAl/TiC cermet joint was investigated. The layered structures consisting of a Ni 3(AlTi) layer, a Ni 2AlTi layer, a (Ni,Al,Ti) layer and a Ni diffusion layer were observed from the interlayer to the TiAl substrate. Only one AlNi 3 layer formed at the multilayer/TiC cermet interface. The reaction behaviour of Al/Ni multilayers was characterized by means of differential scanning calorimeter (DSC) and X-ray diffraction. The initial exothermic peak of the DSC curve was formed due to the formation of Al 3Ni and Al 3Ni 2 phases. The reaction sequence of the Al/Ni multilayers was Al 3Ni → Al 3Ni 2 → AlNi → AlNi 3 and the final products were AlNi and AlNi 3 phases. The shear strength of the joint was tested and the experimental results suggested that the application of Al/Ni multilayers improved the joining quality.

AB - The Al/Ni multilayers were characterized and diffusion bonding of TiAl intermetallics to TiC cermets was carried out using the multilayers. The microstructure of Al/Ni multilayers and TiAl/TiC cermet joint was investigated. The layered structures consisting of a Ni 3(AlTi) layer, a Ni 2AlTi layer, a (Ni,Al,Ti) layer and a Ni diffusion layer were observed from the interlayer to the TiAl substrate. Only one AlNi 3 layer formed at the multilayer/TiC cermet interface. The reaction behaviour of Al/Ni multilayers was characterized by means of differential scanning calorimeter (DSC) and X-ray diffraction. The initial exothermic peak of the DSC curve was formed due to the formation of Al 3Ni and Al 3Ni 2 phases. The reaction sequence of the Al/Ni multilayers was Al 3Ni → Al 3Ni 2 → AlNi → AlNi 3 and the final products were AlNi and AlNi 3 phases. The shear strength of the joint was tested and the experimental results suggested that the application of Al/Ni multilayers improved the joining quality.

KW - Al/Ni multilayer

KW - Diffusion bonding

KW - Microstructure

KW - Reaction

KW - Scanning electron microscopy

UR - https://www.scopus.com/pages/publications/84863419426

U2 - 10.1016/j.tsf.2012.01.001

DO - 10.1016/j.tsf.2012.01.001

M3 - 文章

AN - SCOPUS:84863419426

SN - 0040-6090

VL - 520

SP - 3528

EP - 3531

JO - Thin Solid Films

JF - Thin Solid Films

IS - 9

ER -

Characterization of Al/Ni multilayers and their application in diffusion bonding of TiAl to TiC cermet

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this