@inproceedings{2ac0e4758297423286d06f6548bd7f7c,
title = "Characteristics of interfacial microstructure of PBGA solder bump during multi-reflow and aging processes",
abstract = "Characteristics of intermetallic compounds at the interface of PBGA solder ball and Au/Ni/Cu metallization on BT substrate during multi-reflow and aging processes was presented. The eutectic SnPb solder bump was formed by laser reflow first, followed by a secondary infrared reflow process to form solder joint, and then the solder joint was aged at 160°C for various numbers of days; finally, the aged solder joint was reflowed once again. During first laser reflow, the morphology and distribution of AuSn4 IMC were strongly dependent on the laser reflow power and heating time applied, and both changed after the secondary infrared reflow process. The AuSn4 layer formed at the interface in the first laser reflow process dissolved partially after the secondary infrared reflow process, and AuSn4 particles precipitated out at the eutectic cell boundary of the solder. After the aging process, AuSn4 IMC converted into Au-Ni-Sn ternary compounds, and a continuous Ni3Sn4 layer grew out under the Au-Ni-Sn IMC layer. The thickness of Au-Ni-Sn and the Ni3Sn4 IMC layer increased as the aging time increased. When the aged solder joint was reflowed again, the Au-Ni-Sn IMC disappeared at the interface, and continuous Ni3Sn4 IMC transformed to scallop-type morphology.",
keywords = "Aging, Gold, Infrared heating, Intermetallic, Laser transitions, Microstructure, Morphology, Power lasers, Soldering, Tin",
author = "Yanhong Tian and Chunqing Wang and Jicheng Gong",
note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 5th International Conference on Electronic Packaging Technology, ICEPT 2003 ; Conference date: 28-10-2003 Through 30-10-2003",
year = "2003",
doi = "10.1109/EPTC.2003.1298736",
language = "英语",
series = "ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "260--264",
editor = "Keyun Bi and Barnwell, \{Peter G.\} and Jiaji Wang",
booktitle = "ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings",
address = "美国",
}