TY - GEN
T1 - Characteristics of a new non-rosin, lead-free solder paste activity system
AU - Wang, Cuiping
AU - Wang, Jian
AU - Wang, Juan
AU - Chen, Liang
AU - Liu, Xingjun
PY - 2011
Y1 - 2011
N2 - In this work, an activator system used for no-rosin lead-free solder paste was prepared by compounding with 5-Sulposalicylic acid dehydrate and an organic which restrains the over-quick release of the activator. The composition of the active system was studied by thermal gravimetric analysis. Additional, characterizations of the solder paste with various formula such as viscosity, wettability and shelf life have been evaluated. The solder paste performs the best wettability, the lowest residue, and improved shelf life when the weight percentage of 5-Sulposalicylic acid dehydrate to activity control agent is 20 to 47 in the activity system.
AB - In this work, an activator system used for no-rosin lead-free solder paste was prepared by compounding with 5-Sulposalicylic acid dehydrate and an organic which restrains the over-quick release of the activator. The composition of the active system was studied by thermal gravimetric analysis. Additional, characterizations of the solder paste with various formula such as viscosity, wettability and shelf life have been evaluated. The solder paste performs the best wettability, the lowest residue, and improved shelf life when the weight percentage of 5-Sulposalicylic acid dehydrate to activity control agent is 20 to 47 in the activity system.
UR - https://www.scopus.com/pages/publications/84863025296
U2 - 10.1109/ISAPM.2011.6105710
DO - 10.1109/ISAPM.2011.6105710
M3 - 会议稿件
AN - SCOPUS:84863025296
SN - 9781467301473
T3 - Proceedings - International Symposium on Advanced Packaging Materials
SP - 250
EP - 256
BT - APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials
T2 - 2011 International Symposium on Advanced Packaging Materials, APM 2011
Y2 - 25 October 2011 through 28 October 2011
ER -