Brief Review of Nanosilver Sintering: Manufacturing and Reliability

Jintao Wang; Si Chen; Luobin Zhang; Xueting Zhao; Fangcheng Duan; Hongtao Chen

doi:10.1007/s11664-021-09078-1

Brief Review of Nanosilver Sintering: Manufacturing and Reliability

Jintao Wang
, Si Chen
, Luobin Zhang
, Xueting Zhao
, Fangcheng Duan
, Hongtao Chen^*

^*Corresponding author for this work

Research output: Contribution to journal › Review article › peer-review

32 Scopus citations

Abstract

In this review, the present status of nanosilver sintering is adapted in detail. This review shows the current scholarly exploration and achievements in this field through the two aspects of manufacturing and reliability. The preparation of nanosilver particles, organic coating and sintering methods, microstructure and failure modules of sintered nanosilver layers are described in detail. Finally, prospects and dilemmas of nanosilver sintering technology as a connection material for semiconductor devices and the directions of future extensions are discussed. Graphic Abstract: [Figure not available: see fulltext.].

Original language	English
Pages (from-to)	5483-5498
Number of pages	16
Journal	Journal of Electronic Materials
Volume	50
Issue number	10
DOIs	https://doi.org/10.1007/s11664-021-09078-1
State	Published - Oct 2021
Externally published	Yes

Keywords

3D integrated packaging
Wide band gap semiconductors
nanosilver sintering

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10.1007/s11664-021-09078-1

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title = "Brief Review of Nanosilver Sintering: Manufacturing and Reliability",

abstract = "In this review, the present status of nanosilver sintering is adapted in detail. This review shows the current scholarly exploration and achievements in this field through the two aspects of manufacturing and reliability. The preparation of nanosilver particles, organic coating and sintering methods, microstructure and failure modules of sintered nanosilver layers are described in detail. Finally, prospects and dilemmas of nanosilver sintering technology as a connection material for semiconductor devices and the directions of future extensions are discussed. Graphic Abstract: [Figure not available: see fulltext.].",

keywords = "3D integrated packaging, Wide band gap semiconductors, nanosilver sintering",

author = "Jintao Wang and Si Chen and Luobin Zhang and Xueting Zhao and Fangcheng Duan and Hongtao Chen",

note = "Publisher Copyright: {\textcopyright} 2021, The Minerals, Metals \& Materials Society.",

year = "2021",

month = oct,

doi = "10.1007/s11664-021-09078-1",

language = "英语",

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T1 - Brief Review of Nanosilver Sintering

T2 - Manufacturing and Reliability

AU - Wang, Jintao

AU - Chen, Si

AU - Zhang, Luobin

AU - Zhao, Xueting

AU - Duan, Fangcheng

AU - Chen, Hongtao

PY - 2021/10

Y1 - 2021/10

N2 - In this review, the present status of nanosilver sintering is adapted in detail. This review shows the current scholarly exploration and achievements in this field through the two aspects of manufacturing and reliability. The preparation of nanosilver particles, organic coating and sintering methods, microstructure and failure modules of sintered nanosilver layers are described in detail. Finally, prospects and dilemmas of nanosilver sintering technology as a connection material for semiconductor devices and the directions of future extensions are discussed. Graphic Abstract: [Figure not available: see fulltext.].

AB - In this review, the present status of nanosilver sintering is adapted in detail. This review shows the current scholarly exploration and achievements in this field through the two aspects of manufacturing and reliability. The preparation of nanosilver particles, organic coating and sintering methods, microstructure and failure modules of sintered nanosilver layers are described in detail. Finally, prospects and dilemmas of nanosilver sintering technology as a connection material for semiconductor devices and the directions of future extensions are discussed. Graphic Abstract: [Figure not available: see fulltext.].

KW - 3D integrated packaging

KW - Wide band gap semiconductors

KW - nanosilver sintering

UR - https://www.scopus.com/pages/publications/85112608749

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DO - 10.1007/s11664-021-09078-1

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SN - 0361-5235

VL - 50

SP - 5483

EP - 5498

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 10

ER -

Brief Review of Nanosilver Sintering: Manufacturing and Reliability

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Keywords

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