Bonding mechanism of ultrasonically soldered silica glasses using tin-titanium solder filler

Xiaowei Wu; Zhuolin Li; Xiaoguo Song; Hongjie Dong; Xiaoyu Yang; Yuanliang Li; Shoujing Wei; Junhong Fu

doi:10.1016/j.matlet.2021.131490

Bonding mechanism of ultrasonically soldered silica glasses using tin-titanium solder filler

Xiaowei Wu
, Zhuolin Li^*
, Xiaoguo Song
, Hongjie Dong
, Xiaoyu Yang
, Yuanliang Li
, Shoujing Wei
, Junhong Fu

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology
Harbin Institute of Technology Weihai
Shandong Institute of Shipbuilding Technology

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

In this work, the ultrasonic assisted active metal soldering of silica glasses was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250 °C in ambient atmosphere. A nano-crystalline layer of R-TiO₂ with an average thickness of 7.6 nm formed at the interface between silica glasses and Sn-2Ti solder filler, which verified that a sono-oxidation reaction has occurred during the ultrasonic assisted active metal soldering process. The soldered butt joints exhibited an average tensile strength of 25.3 MPa.

Original language	English
Article number	131490
Journal	Materials Letters
Volume	310
DOIs	https://doi.org/10.1016/j.matlet.2021.131490
State	Published - 1 Mar 2022

Keywords

Bonding
Fracture
Interface
Intermetallic compounds
Microstructure
Oxidation

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10.1016/j.matlet.2021.131490

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title = "Bonding mechanism of ultrasonically soldered silica glasses using tin-titanium solder filler",

abstract = "In this work, the ultrasonic assisted active metal soldering of silica glasses was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250 °C in ambient atmosphere. A nano-crystalline layer of R-TiO2 with an average thickness of 7.6 nm formed at the interface between silica glasses and Sn-2Ti solder filler, which verified that a sono-oxidation reaction has occurred during the ultrasonic assisted active metal soldering process. The soldered butt joints exhibited an average tensile strength of 25.3 MPa.",

keywords = "Bonding, Fracture, Interface, Intermetallic compounds, Microstructure, Oxidation",

author = "Xiaowei Wu and Zhuolin Li and Xiaoguo Song and Hongjie Dong and Xiaoyu Yang and Yuanliang Li and Shoujing Wei and Junhong Fu",

note = "Publisher Copyright: {\textcopyright} 2021",

year = "2022",

month = mar,

day = "1",

doi = "10.1016/j.matlet.2021.131490",

language = "英语",

volume = "310",

journal = "Materials Letters",

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TY - JOUR

T1 - Bonding mechanism of ultrasonically soldered silica glasses using tin-titanium solder filler

AU - Wu, Xiaowei

AU - Li, Zhuolin

AU - Song, Xiaoguo

AU - Dong, Hongjie

AU - Yang, Xiaoyu

AU - Li, Yuanliang

AU - Wei, Shoujing

AU - Fu, Junhong

PY - 2022/3/1

Y1 - 2022/3/1

N2 - In this work, the ultrasonic assisted active metal soldering of silica glasses was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250 °C in ambient atmosphere. A nano-crystalline layer of R-TiO2 with an average thickness of 7.6 nm formed at the interface between silica glasses and Sn-2Ti solder filler, which verified that a sono-oxidation reaction has occurred during the ultrasonic assisted active metal soldering process. The soldered butt joints exhibited an average tensile strength of 25.3 MPa.

AB - In this work, the ultrasonic assisted active metal soldering of silica glasses was successfully achieved using Sn-2Ti solder filler at a low soldering temperature of 250 °C in ambient atmosphere. A nano-crystalline layer of R-TiO2 with an average thickness of 7.6 nm formed at the interface between silica glasses and Sn-2Ti solder filler, which verified that a sono-oxidation reaction has occurred during the ultrasonic assisted active metal soldering process. The soldered butt joints exhibited an average tensile strength of 25.3 MPa.

KW - Bonding

KW - Fracture

KW - Interface

KW - Intermetallic compounds

KW - Microstructure

KW - Oxidation

UR - https://www.scopus.com/pages/publications/85121416390

U2 - 10.1016/j.matlet.2021.131490

DO - 10.1016/j.matlet.2021.131490

M3 - 文章

AN - SCOPUS:85121416390

SN - 0167-577X

VL - 310

JO - Materials Letters

JF - Materials Letters

M1 - 131490

ER -

Bonding mechanism of ultrasonically soldered silica glasses using tin-titanium solder filler

Abstract

Keywords

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