Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

Yong Xiao; Zhipeng Song; Shan Li; Dan Li; Zhihao Zhang; Mingyu Li; Russell Goodall

doi:10.1016/j.msea.2020.139691

Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

Yong Xiao^*
, Zhipeng Song
, Shan Li
, Dan Li
, Zhihao Zhang^*
, Mingyu Li
, Russell Goodall

^*Corresponding author for this work

Wuhan University of Technology
University of Sheffield
Xiamen University
Harbin Institute of Technology Shenzhen

Research output: Contribution to journal › Article › peer-review

23 Scopus citations

Abstract

Ni-foam reinforced Sn-based composite solder was employed to join ultrafine grain 7075 Al alloy with the assistance of ultrasound. The solder seam was mainly composed of Ni skeletons, Sn-based solder, α-Al phase and very fine (hundreds of nanometers to several microns diameter) Ni₃Sn₄ particles. Discontinuous networks surrounded by the fine Ni₃Sn₄ and α-Al particles were in-situ formed in the solder seam, the diameter of which was decreased with increasing soldering time. Smooth transition of the lattice from Al substrate to Sn-based solder was achieved by the formation of an amorphous Al₂O₃ interlayer at the interface. The microstructure evolution mechanism and the amorphous Al₂O₃ interlayer formation mechanism are discussed in detail. The shear strength of Al/Ni-Sn/Al joints increased with prolonging soldering time. The Al/Ni-Sn/Al joint ultrasonically soldered for 60 s exhibits a shear strength of 71.4 MPa, which was approximately 37% higher than that soldered with pure Sn solder.

Original language	English
Article number	139691
Journal	Materials Science and Engineering: A
Volume	791
DOIs	https://doi.org/10.1016/j.msea.2020.139691
State	Published - 22 Jul 2020
Externally published	Yes

Keywords

Bonding mechanism
Microstructure
Ni-foam/Sn composite solder
Ultrafine grained Al alloy
Ultrasonic soldering

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10.1016/j.msea.2020.139691

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title = "Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil",

abstract = "Ni-foam reinforced Sn-based composite solder was employed to join ultrafine grain 7075 Al alloy with the assistance of ultrasound. The solder seam was mainly composed of Ni skeletons, Sn-based solder, α-Al phase and very fine (hundreds of nanometers to several microns diameter) Ni3Sn4 particles. Discontinuous networks surrounded by the fine Ni3Sn4 and α-Al particles were in-situ formed in the solder seam, the diameter of which was decreased with increasing soldering time. Smooth transition of the lattice from Al substrate to Sn-based solder was achieved by the formation of an amorphous Al2O3 interlayer at the interface. The microstructure evolution mechanism and the amorphous Al2O3 interlayer formation mechanism are discussed in detail. The shear strength of Al/Ni-Sn/Al joints increased with prolonging soldering time. The Al/Ni-Sn/Al joint ultrasonically soldered for 60 s exhibits a shear strength of 71.4 MPa, which was approximately 37\% higher than that soldered with pure Sn solder.",

keywords = "Bonding mechanism, Microstructure, Ni-foam/Sn composite solder, Ultrafine grained Al alloy, Ultrasonic soldering",

author = "Yong Xiao and Zhipeng Song and Shan Li and Dan Li and Zhihao Zhang and Mingyu Li and Russell Goodall",

note = "Publisher Copyright: {\textcopyright} 2020 Elsevier B.V.",

year = "2020",

month = jul,

day = "22",

doi = "10.1016/j.msea.2020.139691",

language = "英语",

volume = "791",

journal = "Materials Science and Engineering: A",

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TY - JOUR

T1 - Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

AU - Xiao, Yong

AU - Song, Zhipeng

AU - Li, Shan

AU - Li, Dan

AU - Zhang, Zhihao

AU - Li, Mingyu

AU - Goodall, Russell

PY - 2020/7/22

Y1 - 2020/7/22

N2 - Ni-foam reinforced Sn-based composite solder was employed to join ultrafine grain 7075 Al alloy with the assistance of ultrasound. The solder seam was mainly composed of Ni skeletons, Sn-based solder, α-Al phase and very fine (hundreds of nanometers to several microns diameter) Ni3Sn4 particles. Discontinuous networks surrounded by the fine Ni3Sn4 and α-Al particles were in-situ formed in the solder seam, the diameter of which was decreased with increasing soldering time. Smooth transition of the lattice from Al substrate to Sn-based solder was achieved by the formation of an amorphous Al2O3 interlayer at the interface. The microstructure evolution mechanism and the amorphous Al2O3 interlayer formation mechanism are discussed in detail. The shear strength of Al/Ni-Sn/Al joints increased with prolonging soldering time. The Al/Ni-Sn/Al joint ultrasonically soldered for 60 s exhibits a shear strength of 71.4 MPa, which was approximately 37% higher than that soldered with pure Sn solder.

AB - Ni-foam reinforced Sn-based composite solder was employed to join ultrafine grain 7075 Al alloy with the assistance of ultrasound. The solder seam was mainly composed of Ni skeletons, Sn-based solder, α-Al phase and very fine (hundreds of nanometers to several microns diameter) Ni3Sn4 particles. Discontinuous networks surrounded by the fine Ni3Sn4 and α-Al particles were in-situ formed in the solder seam, the diameter of which was decreased with increasing soldering time. Smooth transition of the lattice from Al substrate to Sn-based solder was achieved by the formation of an amorphous Al2O3 interlayer at the interface. The microstructure evolution mechanism and the amorphous Al2O3 interlayer formation mechanism are discussed in detail. The shear strength of Al/Ni-Sn/Al joints increased with prolonging soldering time. The Al/Ni-Sn/Al joint ultrasonically soldered for 60 s exhibits a shear strength of 71.4 MPa, which was approximately 37% higher than that soldered with pure Sn solder.

KW - Bonding mechanism

KW - Microstructure

KW - Ni-foam/Sn composite solder

KW - Ultrafine grained Al alloy

KW - Ultrasonic soldering

UR - https://www.scopus.com/pages/publications/85087071799

U2 - 10.1016/j.msea.2020.139691

DO - 10.1016/j.msea.2020.139691

M3 - 文章

AN - SCOPUS:85087071799

SN - 0921-5093

VL - 791

JO - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

M1 - 139691

ER -

Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

Abstract

Keywords

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