@inproceedings{bef1ccaa10e442a193d10b193dd984af,
title = "Bond mechanics and failure mode of conductive silver adhesive for transducer",
abstract = "In this paper, a novel conductive silver adhesive (ECA) for transducer is prepared to bond piezoelectric patch and the aluminum substrate. X-ray photoelectron spectroscopy (XPS) is used to study the fracture elements in order to analyze bond mechanics, fracture morphology is observation by scanning electron microscopy (SEM). The result of test and analysis shows ECA with sliane coupling agent have both physical and chemical bonding and the fracture type is cohesive failure. However the ECA without sliane coupling agent only has physical bonding and fracture type is mixed failure.",
keywords = "Bond mechanics, Conductive silver adhesive (ECA), Failure mode",
author = "Wang, \{Chun Ying\} and Rui Zhang",
year = "2014",
doi = "10.4028/www.scientific.net/AMR.873.837",
language = "英语",
isbn = "9783037859698",
series = "Advanced Materials Research",
pages = "837--844",
booktitle = "8th China National Conference on Functional Materials and Applications",
note = "8th China National Conference on Functional Materials and Applications, NCFMA 2013 ; Conference date: 23-08-2013 Through 26-08-2013",
}