Bioinspired Janus Microfluidic Heat Sink for Ultra-Efficient CPU Cooling via Millisecond-Scale Bubble Transport

Efficient thermal management is increasingly critical for high-performance computing and emerging artificial intelligence hardware, where heat fluxes exceed the capabilities of conventional heat sinks. Here, a 3D-printed bioinspired Janus microchannel heat sink is reported that enables ultrafast bubble transport and stable two-phase cooling for electronic devices. Inspired by the Namib desert beetle, the heat sink integrates asymmetric wettability-a superhydrophobic top surface and hydrophilic bottom surface-creating a Laplace pressure-driven pathway for millisecond-scale bubble removal. This architecture suppresses vapor-film formation, maintains continuous liquid replenishment, and achieves a critical heat flux (CHF) of 105 W cm⁻², representing an up to 125% improvement over conventional microchannel heat sinks. Integrated into a commercial CPU, the Janus microfluidic heat sink maintains maximum clock frequency under full load without thermal throttling, demonstrating a scalable material-driven solution for next-generation thermal management. This bioinspired approach establishes a platform for programmable surface functionality in high-power electronics, with potential applications in data centers, electric vehicles, and aerospace systems.