Automatic wire bonder designed for MEMS packaging

Yanjie Liu; Yuetao Liu; Lining Sun

doi:10.1109/DTIP.2008.4752944

Automatic wire bonder designed for MEMS packaging

Yanjie Liu^*
, Yuetao Liu^*
, Lining Sun

^*Corresponding author for this work

School of Mechatronics Engineering

Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

This paper introduces zoom microscope into the microscope positioning system to settle the contradiction between microscope's visual range and depth of field. In the whole bonding application, bond targets' identification and orientation are the most important aspects for full-automation. Multiple scale images go through various image processing programs, and finally different bond targets are identified and positioned. This measure is called "global-coarse and local-precise orientation", with which full-automation bonding is realized. A zoom microscope based micro-positioning system was used to capture the multiple magnification images. The requirement for real-time auto-focusing for zoom microscope is proposed based on the analysis of zoom microscope model.

Original language	English
Title of host publication	DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Pages	21-23
Number of pages	3
DOIs	https://doi.org/10.1109/DTIP.2008.4752944
State	Published - 2008
Event	DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Nice, France Duration: 9 Apr 2008 → 11 Apr 2008

Publication series

Name	DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Conference

Conference	DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Country/Territory	France
City	Nice
Period	9/04/08 → 11/04/08

Access to Document

10.1109/DTIP.2008.4752944

Cite this

@inproceedings{94b64bfb5d554ee78aed3973635dc5f1,

title = "Automatic wire bonder designed for MEMS packaging",

abstract = "This paper introduces zoom microscope into the microscope positioning system to settle the contradiction between microscope's visual range and depth of field. In the whole bonding application, bond targets' identification and orientation are the most important aspects for full-automation. Multiple scale images go through various image processing programs, and finally different bond targets are identified and positioned. This measure is called {"}global-coarse and local-precise orientation{"}, with which full-automation bonding is realized. A zoom microscope based micro-positioning system was used to capture the multiple magnification images. The requirement for real-time auto-focusing for zoom microscope is proposed based on the analysis of zoom microscope model.",

author = "Yanjie Liu and Yuetao Liu and Lining Sun",

year = "2008",

doi = "10.1109/DTIP.2008.4752944",

language = "英语",

isbn = "9782355000065",

series = "DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS",

pages = "21--23",

booktitle = "DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS",

note = "DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS ; Conference date: 09-04-2008 Through 11-04-2008",

}

Liu, Y, Liu, Y & Sun, L 2008, Automatic wire bonder designed for MEMS packaging. in DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS., 4752944, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, pp. 21-23, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Nice, France, 9/04/08. https://doi.org/10.1109/DTIP.2008.4752944

Automatic wire bonder designed for MEMS packaging. / Liu, Yanjie; Liu, Yuetao; Sun, Lining.
DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. 2008. p. 21-23 4752944 (DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Automatic wire bonder designed for MEMS packaging

AU - Liu, Yanjie

AU - Liu, Yuetao

AU - Sun, Lining

PY - 2008

Y1 - 2008

N2 - This paper introduces zoom microscope into the microscope positioning system to settle the contradiction between microscope's visual range and depth of field. In the whole bonding application, bond targets' identification and orientation are the most important aspects for full-automation. Multiple scale images go through various image processing programs, and finally different bond targets are identified and positioned. This measure is called "global-coarse and local-precise orientation", with which full-automation bonding is realized. A zoom microscope based micro-positioning system was used to capture the multiple magnification images. The requirement for real-time auto-focusing for zoom microscope is proposed based on the analysis of zoom microscope model.

AB - This paper introduces zoom microscope into the microscope positioning system to settle the contradiction between microscope's visual range and depth of field. In the whole bonding application, bond targets' identification and orientation are the most important aspects for full-automation. Multiple scale images go through various image processing programs, and finally different bond targets are identified and positioned. This measure is called "global-coarse and local-precise orientation", with which full-automation bonding is realized. A zoom microscope based micro-positioning system was used to capture the multiple magnification images. The requirement for real-time auto-focusing for zoom microscope is proposed based on the analysis of zoom microscope model.

UR - https://www.scopus.com/pages/publications/62249095327

U2 - 10.1109/DTIP.2008.4752944

DO - 10.1109/DTIP.2008.4752944

M3 - 会议稿件

AN - SCOPUS:62249095327

SN - 9782355000065

T3 - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

SP - 21

EP - 23

BT - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

T2 - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Y2 - 9 April 2008 through 11 April 2008

ER -

Automatic wire bonder designed for MEMS packaging

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