Assessment of fluxless solid liquid interdiffusion bonding by compressive force of Au-PbSn and Au-SAC for flip chip packaging

Teck Kheng Lee; Sam Zhang; C. C. Wong; A. C. Tan

doi:10.1109/ECTC.2007.374024

Assessment of fluxless solid liquid interdiffusion bonding by compressive force of Au-PbSn and Au-SAC for flip chip packaging

Teck Kheng Lee^*
, Sam Zhang
, C. C. Wong
, A. C. Tan

^*Corresponding author for this work

Micron Semiconductor Asia Pte Ltd.
Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

Flip chip packaging faces two primary bonding-process obstacles: flux use and geometry mismatch between die and substrate pad pitch. These obstacles motivated the development of a fluxless bonding method called solid-liquid mterdiffusion bonding by compressive force (SLICF). SLICF utilizes a mechanical force to form the bond through solidliquid interdiffusion with a joint-in-via (JIV) architecture for flip chip packaging. SLICF bonding (also known as Thermomiechanical (TM) bonding) forms an instantaneous bond and eliminates the need for reflow infrastructure. Both Au-PbSn and Au-SAC interconnect systems were studied for the SLICF bonding on the JIV architecture at a 130 μm pitch. The morphologies of Au-PbSn and Au-SAC in solid-liquid interdiffusion were studied with their kinetics measured by the Au consumption rate. The SLIFC bonds for Au-PbSn and Au-SAC were compared and assessed by mechanical shear tests and thermomechanical stresses. Au with PbSn was found to perform marginally better due to its joint geometry and slower kinetics.

Original language	English
Title of host publication	Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages	1701-1706
Number of pages	6
DOIs	https://doi.org/10.1109/ECTC.2007.374024
State	Published - 2007
Externally published	Yes
Event	57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States Duration: 29 May 2007 → 1 Jun 2007

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	57th Electronic Components and Technology Conference 2007, ECTC '07
Country/Territory	United States
City	Sparks, NV
Period	29/05/07 → 1/06/07

Access to Document

10.1109/ECTC.2007.374024

Cite this

Lee, T. K., Zhang, S., Wong, C. C., & Tan, A. C. (2007). Assessment of fluxless solid liquid interdiffusion bonding by compressive force of Au-PbSn and Au-SAC for flip chip packaging. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 (pp. 1701-1706). Article 4250110 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2007.374024

@inproceedings{ac62c2bb7fea4949bc3546aa3569b566,

title = "Assessment of fluxless solid liquid interdiffusion bonding by compressive force of Au-PbSn and Au-SAC for flip chip packaging",

abstract = "Flip chip packaging faces two primary bonding-process obstacles: flux use and geometry mismatch between die and substrate pad pitch. These obstacles motivated the development of a fluxless bonding method called solid-liquid mterdiffusion bonding by compressive force (SLICF). SLICF utilizes a mechanical force to form the bond through solidliquid interdiffusion with a joint-in-via (JIV) architecture for flip chip packaging. SLICF bonding (also known as Thermomiechanical (TM) bonding) forms an instantaneous bond and eliminates the need for reflow infrastructure. Both Au-PbSn and Au-SAC interconnect systems were studied for the SLICF bonding on the JIV architecture at a 130 μm pitch. The morphologies of Au-PbSn and Au-SAC in solid-liquid interdiffusion were studied with their kinetics measured by the Au consumption rate. The SLIFC bonds for Au-PbSn and Au-SAC were compared and assessed by mechanical shear tests and thermomechanical stresses. Au with PbSn was found to perform marginally better due to its joint geometry and slower kinetics.",

author = "Lee, \{Teck Kheng\} and Sam Zhang and Wong, \{C. C.\} and Tan, \{A. C.\}",

year = "2007",

doi = "10.1109/ECTC.2007.374024",

language = "英语",

isbn = "1424409853",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "1701--1706",

booktitle = "Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07",

note = "57th Electronic Components and Technology Conference 2007, ECTC '07 ; Conference date: 29-05-2007 Through 01-06-2007",

}

Lee, TK, Zhang, S, Wong, CC & Tan, AC 2007, Assessment of fluxless solid liquid interdiffusion bonding by compressive force of Au-PbSn and Au-SAC for flip chip packaging. in Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07., 4250110, Proceedings - Electronic Components and Technology Conference, pp. 1701-1706, 57th Electronic Components and Technology Conference 2007, ECTC '07, Sparks, NV, United States, 29/05/07. https://doi.org/10.1109/ECTC.2007.374024

Assessment of fluxless solid liquid interdiffusion bonding by compressive force of Au-PbSn and Au-SAC for flip chip packaging. / Lee, Teck Kheng; Zhang, Sam; Wong, C. C. et al.
Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. 2007. p. 1701-1706 4250110 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Assessment of fluxless solid liquid interdiffusion bonding by compressive force of Au-PbSn and Au-SAC for flip chip packaging

AU - Lee, Teck Kheng

AU - Zhang, Sam

AU - Wong, C. C.

AU - Tan, A. C.

PY - 2007

Y1 - 2007

N2 - Flip chip packaging faces two primary bonding-process obstacles: flux use and geometry mismatch between die and substrate pad pitch. These obstacles motivated the development of a fluxless bonding method called solid-liquid mterdiffusion bonding by compressive force (SLICF). SLICF utilizes a mechanical force to form the bond through solidliquid interdiffusion with a joint-in-via (JIV) architecture for flip chip packaging. SLICF bonding (also known as Thermomiechanical (TM) bonding) forms an instantaneous bond and eliminates the need for reflow infrastructure. Both Au-PbSn and Au-SAC interconnect systems were studied for the SLICF bonding on the JIV architecture at a 130 μm pitch. The morphologies of Au-PbSn and Au-SAC in solid-liquid interdiffusion were studied with their kinetics measured by the Au consumption rate. The SLIFC bonds for Au-PbSn and Au-SAC were compared and assessed by mechanical shear tests and thermomechanical stresses. Au with PbSn was found to perform marginally better due to its joint geometry and slower kinetics.

AB - Flip chip packaging faces two primary bonding-process obstacles: flux use and geometry mismatch between die and substrate pad pitch. These obstacles motivated the development of a fluxless bonding method called solid-liquid mterdiffusion bonding by compressive force (SLICF). SLICF utilizes a mechanical force to form the bond through solidliquid interdiffusion with a joint-in-via (JIV) architecture for flip chip packaging. SLICF bonding (also known as Thermomiechanical (TM) bonding) forms an instantaneous bond and eliminates the need for reflow infrastructure. Both Au-PbSn and Au-SAC interconnect systems were studied for the SLICF bonding on the JIV architecture at a 130 μm pitch. The morphologies of Au-PbSn and Au-SAC in solid-liquid interdiffusion were studied with their kinetics measured by the Au consumption rate. The SLIFC bonds for Au-PbSn and Au-SAC were compared and assessed by mechanical shear tests and thermomechanical stresses. Au with PbSn was found to perform marginally better due to its joint geometry and slower kinetics.

UR - https://www.scopus.com/pages/publications/35348870951

U2 - 10.1109/ECTC.2007.374024

DO - 10.1109/ECTC.2007.374024

M3 - 会议稿件

AN - SCOPUS:35348870951

SN - 1424409853

SN - 9781424409853

T3 - Proceedings - Electronic Components and Technology Conference

SP - 1701

EP - 1706

BT - Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07

T2 - 57th Electronic Components and Technology Conference 2007, ECTC '07

Y2 - 29 May 2007 through 1 June 2007

ER -

Lee TK, Zhang S, Wong CC, Tan AC. Assessment of fluxless solid liquid interdiffusion bonding by compressive force of Au-PbSn and Au-SAC for flip chip packaging. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. 2007. p. 1701-1706. 4250110. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2007.374024

Assessment of fluxless solid liquid interdiffusion bonding by compressive force of Au-PbSn and Au-SAC for flip chip packaging

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this