Abstract
Thermoelectric (TE) technology employing the Seebeck effect and the Peltier effect can directly realize the mutual conversion of thermal energy and electric energy via the carrier’s movement. In this chapter we start by discussing the basic TE effect and TE devices. Then we introduce TE thin films, which have received much attention for their unique properties, such as high crystallinity, preferential orientation, and flexibility. A variety of ion plating techniques, including molecular beam epitaxy, magnetron sputtering, and pulsed laser deposition for preparing TE thin films, are summarized, and the corresponding TE thin films with different functions are discussed. Ion plating technology also plays an essential role in connecting TE devices, such as the preparation of the electrode and transition layer. Compared with the electroplating process, the electrode and transition layer deposited by magnetron sputtering have the advantages of a smooth surface, good adhesion, and low contact resistance.
| Original language | English |
|---|---|
| Title of host publication | Modern Ion Plating Technology |
| Subtitle of host publication | Fundamentals and Applications |
| Publisher | Elsevier |
| Pages | 459-473 |
| Number of pages | 15 |
| ISBN (Electronic) | 9780323908337 |
| ISBN (Print) | 9780323908344 |
| DOIs | |
| State | Published - 1 Jan 2023 |
| Externally published | Yes |
Keywords
- Thermoelectric (TE)
- flexibility
- ion plating technology
- physical vapor deposition (PVD)
- thermoelectric generator (TEG)
- thin films
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