Application of thermal resistance net model in optimization design of microchannel cooling heat sink

Taking the thermal resistance and the pressure drop as objective functions, a multi-objective optimization model was proposed for the microchannd cooling heat sink based on the thermal resistance network model. The sequential quadratic programming procedure was used to do the optimization design of the structure size of the microchannel. For the heat sink to cool a chip with the sizes of L × W=6 mm × 6 mm and the power of 100 W, the optimized width and height of the microchannel are 120 μm and 815 μm respectively, and its corresponding total thermal resistance is 0.413 K/W The optimized microchannel heat sink was numerically simulated by a computational fluid-dynamics software, and its results agreed well with those predicted by the proposed model.