TY - GEN
T1 - Anodic bonding technology of slender glass tube and silicon in pressure sensor packaging
AU - Chen, Tao
AU - Sun, Lining
AU - Pan, Mingqiang
AU - Wang, Yangjun
AU - Liu, Jizhu
AU - Chen, Liguo
PY - 2013
Y1 - 2013
N2 - Anodic bonding technology of semiconductor silicon and glass is a key technology of micro electronic mechanical system (MEMS). Because of large bonding strength and simple process, silicon-glass anodic bonding is popular in piezoresistive pressure sensor. In order to improve sensors performance, the glass tube is designed to be elongated and slender. However, the special design brings difficulty for anodic bonding. The traditional bonding way is unavailable and bonding failure rate increases dramatically. In this paper, the bonding process of slender glass tube and silicon is present, and a novel bonding device is designed based on the silicon-glass bonding process. The results show that the bonding is the best when the cantilever elastic deformation is less than 0.5mm interface temperature loaded from the silicon is 415°C and the voltage 1200V is loaded from the position H=2mm.
AB - Anodic bonding technology of semiconductor silicon and glass is a key technology of micro electronic mechanical system (MEMS). Because of large bonding strength and simple process, silicon-glass anodic bonding is popular in piezoresistive pressure sensor. In order to improve sensors performance, the glass tube is designed to be elongated and slender. However, the special design brings difficulty for anodic bonding. The traditional bonding way is unavailable and bonding failure rate increases dramatically. In this paper, the bonding process of slender glass tube and silicon is present, and a novel bonding device is designed based on the silicon-glass bonding process. The results show that the bonding is the best when the cantilever elastic deformation is less than 0.5mm interface temperature loaded from the silicon is 415°C and the voltage 1200V is loaded from the position H=2mm.
UR - https://www.scopus.com/pages/publications/84897786769
U2 - 10.1109/EPTC.2013.6745834
DO - 10.1109/EPTC.2013.6745834
M3 - 会议稿件
AN - SCOPUS:84897786769
SN - 9781479928330
T3 - Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
SP - 813
EP - 816
BT - Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
T2 - 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Y2 - 11 December 2013 through 13 December 2013
ER -