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Anisotropy-Related Machining Characteristics in Ultra-Precision Diamond Cutting of Crystalline Copper

  • Zhanfeng Wang
  • , Junjie Zhang*
  • , Guo Li
  • , Zongwei Xu
  • , Haijun Zhang
  • , Jianguo Zhang
  • , Alexander Hartmaier
  • , Fengzhou Fang
  • , Yongda Yan
  • , Tao Sun
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • China Academy of Engineering Physics
  • Tianjin University
  • Huazhong University of Science and Technology
  • Ruhr University Bochum

Research output: Contribution to journalArticlepeer-review

Abstract

Deformation behavior at grain levels greatly affects the machining characteristics of crystalline materials. In the present work, we investigate the influence of material anisotropy on ultra-precision diamond cutting of single crystalline and polycrystalline copper by experiments and crystal plasticity finite element simulations. Specifically,diamond turning and in situ SEM orthogonal cutting experiments are carried out to provide direct experimental evidence of the material anisotropy-dependent cutting results in terms of machined surface morphology and chip profile. Corresponding numerical simulations with the analysis of built stress further validate experimental results and reveal the mechanisms governing the material anisotropy influence.The above findings provide insight into the fabrication of ultra-smooth surfaces of polycrystalline metals by ultra-precision diamond turning.

Original languageEnglish
Pages (from-to)123-132
Number of pages10
JournalNanomanufacturing and Metrology
Volume3
Issue number2
DOIs
StatePublished - 1 Jun 2020

Keywords

  • Anisotropy
  • Crystal plasticity finite element
  • Diamond cutting
  • Grain boundary
  • Polycrystalline copper

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