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Analysis of Surface and Subsurface Damage Morphology in Rotary Ultrasonic Machining of BK7 Glass

  • Hong Xiang Wang*
  • , Chu Wang
  • , Jun Liang Liu
  • , Shi Gao
  • , Wen Jie Zhai
  • *Corresponding author for this work
  • School of Mechatronics Engineering, Harbin Institute of Technology

Research output: Contribution to journalConference articlepeer-review

Abstract

This paper investigates the formation process of surface/subsurface damage in the rotary ultrasonic machining of BK7 glass. The results show that during the milling using the end face of the tool, the cutting depth and the residual height between the abrasive grains constantly change with the high-frequency vibration, generating lots of cracks on both sides of the scratches. The high-frequency vibration accelerates the chips falling from the surface, so that the chips and thermal damage are reduced, causing the grinding surface quality better. A plastic deformation area is formed during the grinding, due to the non-uniform cutting force on the material surface, and the residual stress is produced in the deformation area, inducing the median/lateral cracks.

Original languageEnglish
Article number012071
JournalIOP Conference Series: Materials Science and Engineering
Volume269
Issue number1
DOIs
StatePublished - 29 Nov 2017
Externally publishedYes
Event2017 4th International Conference on Advanced Materials, Mechanics and Structural Engineering, AMMSE 2017 - Tianjin, China
Duration: 22 Sep 201724 Sep 2017

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