Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints

Yanhong Tian; Lina Niu; Chunqing Wang

doi:10.1109/ICEPT.2011.6066851

Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints

Yanhong Tian^*
, Lina Niu
, Chunqing Wang

^*Corresponding author for this work

Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

Electron backscatter diffraction (EBSD) technology combined with Orientation Imaging Microscopy (OIM) analysis method were employed to investigate the morphologies and orientations of Cu₆Sn₅ grains formed between Sn3.0Ag5.0Cu and polycrystalline copper, (001) (111) Cu single crystals under liquid-state condition. The reflow temperature was the main factor that influence the transformation of Cu₆Sn₅ grains from scallop-type to prism-type. The morphology for. the prism-type Cu₆Sn₅ grains formed on Cu single crystals arranged regularly, and their orientations had a strong dependence on the Cu substrates, the reason for which is the low misfit leading to the decreasing of surface energy.

Original language	English
Title of host publication	ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
Pages	353-356
Number of pages	4
DOIs	https://doi.org/10.1109/ICEPT.2011.6066851
State	Published - 2011
Externally published	Yes
Event	2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai, China Duration: 8 Aug 2011 → 11 Aug 2011

Publication series

Name	ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Conference

Conference	2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
Country/Territory	China
City	Shanghai
Period	8/08/11 → 11/08/11

Access to Document

10.1109/ICEPT.2011.6066851

Cite this

Tian, Y., Niu, L., & Wang, C. (2011). Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (pp. 353-356). Article 6066851 (ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging). https://doi.org/10.1109/ICEPT.2011.6066851

Tian, Yanhong ; Niu, Lina ; Wang, Chunqing. / Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. pp. 353-356 (ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging).

@inproceedings{bbd84305d09147f58567206c4e421026,

title = "Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints",

abstract = "Electron backscatter diffraction (EBSD) technology combined with Orientation Imaging Microscopy (OIM) analysis method were employed to investigate the morphologies and orientations of Cu6Sn5 grains formed between Sn3.0Ag5.0Cu and polycrystalline copper, (001) (111) Cu single crystals under liquid-state condition. The reflow temperature was the main factor that influence the transformation of Cu6Sn5 grains from scallop-type to prism-type. The morphology for. the prism-type Cu6Sn5 grains formed on Cu single crystals arranged regularly, and their orientations had a strong dependence on the Cu substrates, the reason for which is the low misfit leading to the decreasing of surface energy.",

author = "Yanhong Tian and Lina Niu and Chunqing Wang",

year = "2011",

doi = "10.1109/ICEPT.2011.6066851",

language = "英语",

isbn = "9781457717680",

series = "ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging",

pages = "353--356",

booktitle = "ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging",

note = "2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 ; Conference date: 08-08-2011 Through 11-08-2011",

}

Tian, Y, Niu, L & Wang, C 2011, Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints. in ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging., 6066851, ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, pp. 353-356, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, China, 8/08/11. https://doi.org/10.1109/ICEPT.2011.6066851

Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints. / Tian, Yanhong; Niu, Lina; Wang, Chunqing.
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 353-356 6066851 (ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints

AU - Tian, Yanhong

AU - Niu, Lina

AU - Wang, Chunqing

PY - 2011

Y1 - 2011

N2 - Electron backscatter diffraction (EBSD) technology combined with Orientation Imaging Microscopy (OIM) analysis method were employed to investigate the morphologies and orientations of Cu6Sn5 grains formed between Sn3.0Ag5.0Cu and polycrystalline copper, (001) (111) Cu single crystals under liquid-state condition. The reflow temperature was the main factor that influence the transformation of Cu6Sn5 grains from scallop-type to prism-type. The morphology for. the prism-type Cu6Sn5 grains formed on Cu single crystals arranged regularly, and their orientations had a strong dependence on the Cu substrates, the reason for which is the low misfit leading to the decreasing of surface energy.

AB - Electron backscatter diffraction (EBSD) technology combined with Orientation Imaging Microscopy (OIM) analysis method were employed to investigate the morphologies and orientations of Cu6Sn5 grains formed between Sn3.0Ag5.0Cu and polycrystalline copper, (001) (111) Cu single crystals under liquid-state condition. The reflow temperature was the main factor that influence the transformation of Cu6Sn5 grains from scallop-type to prism-type. The morphology for. the prism-type Cu6Sn5 grains formed on Cu single crystals arranged regularly, and their orientations had a strong dependence on the Cu substrates, the reason for which is the low misfit leading to the decreasing of surface energy.

UR - https://www.scopus.com/pages/publications/81355123892

U2 - 10.1109/ICEPT.2011.6066851

DO - 10.1109/ICEPT.2011.6066851

M3 - 会议稿件

AN - SCOPUS:81355123892

SN - 9781457717680

T3 - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

SP - 353

EP - 356

BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

T2 - 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011

Y2 - 8 August 2011 through 11 August 2011

ER -

Tian Y, Niu L, Wang C. Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 353-356. 6066851. (ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging). doi: 10.1109/ICEPT.2011.6066851

Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this