TY - GEN
T1 - An optimized process of high-performance integrated passive devices (IPDs) on SI-GaAs substrate for RF applications
AU - Li, Yang
AU - Wang, Cong
AU - Kim, Nam Young
PY - 2013
Y1 - 2013
N2 - An integrated passive device (IPD) technology by semi-insulating (SI) GaAs-based fabrication has been developed to meet the ever increasing needs of size and cost reduction for RF and microwave applications. In this paper, we develop an advanced optimized process for realizing IPDs to reduce fabrication time and total cost and to increase RF performances. The critical characteristics of lumped elements thin film resistor (TFR), spiral inductor and metal-insulator-metal (MIM) capacitor are optimized in this advanced process. A low-pass filter (LPF) for global system for mobile communications (GSM) is demonstrated by using this IPD process; it shows very good RF performances in spite of its small chip size and low cost, when compared with the recently reported literature.
AB - An integrated passive device (IPD) technology by semi-insulating (SI) GaAs-based fabrication has been developed to meet the ever increasing needs of size and cost reduction for RF and microwave applications. In this paper, we develop an advanced optimized process for realizing IPDs to reduce fabrication time and total cost and to increase RF performances. The critical characteristics of lumped elements thin film resistor (TFR), spiral inductor and metal-insulator-metal (MIM) capacitor are optimized in this advanced process. A low-pass filter (LPF) for global system for mobile communications (GSM) is demonstrated by using this IPD process; it shows very good RF performances in spite of its small chip size and low cost, when compared with the recently reported literature.
KW - Integrated passive device (IPD)
KW - Process optimization
KW - SU-8 photo-resist (PR)
KW - Si-GaAs substrate
KW - low-pass filter (LPF)
UR - https://www.scopus.com/pages/publications/84893371474
U2 - 10.1109/APMC.2013.6695209
DO - 10.1109/APMC.2013.6695209
M3 - 会议稿件
AN - SCOPUS:84893371474
SN - 9781479914746
T3 - Asia-Pacific Microwave Conference Proceedings, APMC
SP - 116
EP - 118
BT - 2013 Asia-Pacific Microwave Conference Proceedings, APMC 2013
T2 - 2013 3rd Asia-Pacific Microwave Conference, APMC 2013
Y2 - 5 November 2013 through 8 November 2013
ER -