An Interconnected Magneto-Electric (ME) Dipole Array for 5G Communication Application

Wenxu Zhang; Yihong Xu; Zihao Chen

doi:10.1109/IMWS-AMP54652.2022.10107327

An Interconnected Magneto-Electric (ME) Dipole Array for 5G Communication Application

Wenxu Zhang^*
, Yihong Xu
, Zihao Chen

^*Corresponding author for this work

Harbin Institute of Technology Shenzhen
Peng Cheng Laboratory

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper proposes a 1×3 interconnected magneto-electric (ME) dipole array on a single layer of PCB substrate. The magnetoelectric dipole in the center is fed through the L-shaped coupled strip and two passive magnetoelectric dipoles on both sides along the E-plane are fed through microstrip lines. The ME dipole array achieves a simulated impedance bandwidth of 8.6GHz from 22.5GHz to 31.0GHz (30.7%). In addition, the simulated 3dB gain bandwidth is 6.6 GHz from 25.57GHz to 32.19GHz (23.6%). The proposed ME dipole array has the advantages of simple feeding structure, easy fabrication, low profile, light weight, and high gain.

Original language	English
Title of host publication	IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781665478342
DOIs	https://doi.org/10.1109/IMWS-AMP54652.2022.10107327
State	Published - 2022
Externally published	Yes
Event	2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Guangzhou, China Duration: 27 Nov 2022 → 29 Nov 2022

Publication series

Name	IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings

Conference

Conference	2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022
Country/Territory	China
City	Guangzhou
Period	27/11/22 → 29/11/22

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10.1109/IMWS-AMP54652.2022.10107327

Cite this

Zhang, W., Xu, Y., & Chen, Z. (2022). An Interconnected Magneto-Electric (ME) Dipole Array for 5G Communication Application. In IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings (IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMWS-AMP54652.2022.10107327

Zhang, Wenxu ; Xu, Yihong ; Chen, Zihao. / An Interconnected Magneto-Electric (ME) Dipole Array for 5G Communication Application. IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. (IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings).

@inproceedings{dfddee5f822647e787a8fbe3ae54de31,

title = "An Interconnected Magneto-Electric (ME) Dipole Array for 5G Communication Application",

abstract = "This paper proposes a 1×3 interconnected magneto-electric (ME) dipole array on a single layer of PCB substrate. The magnetoelectric dipole in the center is fed through the L-shaped coupled strip and two passive magnetoelectric dipoles on both sides along the E-plane are fed through microstrip lines. The ME dipole array achieves a simulated impedance bandwidth of 8.6GHz from 22.5GHz to 31.0GHz (30.7\%). In addition, the simulated 3dB gain bandwidth is 6.6 GHz from 25.57GHz to 32.19GHz (23.6\%). The proposed ME dipole array has the advantages of simple feeding structure, easy fabrication, low profile, light weight, and high gain.",

author = "Wenxu Zhang and Yihong Xu and Zihao Chen",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 ; Conference date: 27-11-2022 Through 29-11-2022",

year = "2022",

doi = "10.1109/IMWS-AMP54652.2022.10107327",

language = "英语",

series = "IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings",

address = "美国",

}

Zhang, W, Xu, Y & Chen, Z 2022, An Interconnected Magneto-Electric (ME) Dipole Array for 5G Communication Application. in IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings. IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings, Institute of Electrical and Electronics Engineers Inc., 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022, Guangzhou, China, 27/11/22. https://doi.org/10.1109/IMWS-AMP54652.2022.10107327

An Interconnected Magneto-Electric (ME) Dipole Array for 5G Communication Application. / Zhang, Wenxu; Xu, Yihong; Chen, Zihao.
IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. (IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - An Interconnected Magneto-Electric (ME) Dipole Array for 5G Communication Application

AU - Zhang, Wenxu

AU - Xu, Yihong

AU - Chen, Zihao

PY - 2022

Y1 - 2022

N2 - This paper proposes a 1×3 interconnected magneto-electric (ME) dipole array on a single layer of PCB substrate. The magnetoelectric dipole in the center is fed through the L-shaped coupled strip and two passive magnetoelectric dipoles on both sides along the E-plane are fed through microstrip lines. The ME dipole array achieves a simulated impedance bandwidth of 8.6GHz from 22.5GHz to 31.0GHz (30.7%). In addition, the simulated 3dB gain bandwidth is 6.6 GHz from 25.57GHz to 32.19GHz (23.6%). The proposed ME dipole array has the advantages of simple feeding structure, easy fabrication, low profile, light weight, and high gain.

AB - This paper proposes a 1×3 interconnected magneto-electric (ME) dipole array on a single layer of PCB substrate. The magnetoelectric dipole in the center is fed through the L-shaped coupled strip and two passive magnetoelectric dipoles on both sides along the E-plane are fed through microstrip lines. The ME dipole array achieves a simulated impedance bandwidth of 8.6GHz from 22.5GHz to 31.0GHz (30.7%). In addition, the simulated 3dB gain bandwidth is 6.6 GHz from 25.57GHz to 32.19GHz (23.6%). The proposed ME dipole array has the advantages of simple feeding structure, easy fabrication, low profile, light weight, and high gain.

UR - https://www.scopus.com/pages/publications/85159216875

U2 - 10.1109/IMWS-AMP54652.2022.10107327

DO - 10.1109/IMWS-AMP54652.2022.10107327

M3 - 会议稿件

AN - SCOPUS:85159216875

T3 - IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings

BT - IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022

Y2 - 27 November 2022 through 29 November 2022

ER -

Zhang W, Xu Y, Chen Z. An Interconnected Magneto-Electric (ME) Dipole Array for 5G Communication Application. In IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2022. (IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2022 - Proceedings). doi: 10.1109/IMWS-AMP54652.2022.10107327

An Interconnected Magneto-Electric (ME) Dipole Array for 5G Communication Application

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