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An alternative micro-area X-ray diffraction method for residual stress measurement of Pb(Zr,Ti)O3 film

  • F. Yang*
  • , W. D. Fei
  • , Z. M. Gao
  • , J. Q. Jiang
  • *Corresponding author for this work
  • Southeast University, Nanjing
  • Harbin Institute of Technology
  • College of Chemistry

Research output: Contribution to journalArticlepeer-review

Abstract

An alternative X-ray diffraction method for micro-area residual stress measurement was proposed by means of the analysis of a single diffraction ring, which was performed on a laboratory X-ray microdiffraction system equipped with a 2D planar detector. The microdiffraction experiments were employed to evaluate the residual stress in sol-gel-derived Pb(Zr,Ti)O3 film before and after Ag electrode deposition. The tensile stresses of about 2.3 GPa and 1.2 GPa were calculated in the micro-area of film without and with electrode, which was related to a top electrode stress relaxation effect.

Original languageEnglish
Pages (from-to)121-125
Number of pages5
JournalSurface and Coatings Technology
Volume202
Issue number1
DOIs
StatePublished - 15 Nov 2007
Externally publishedYes

Keywords

  • Ag electrode
  • Residual stress
  • Sol-gel
  • XRD

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